IP Library Granted Patent US 6,969,472
Granted Patent B2
US 6,969,472 · App. 09/842,214 · Granted Nov 29, 2005

Method of fabricating sub-micron hemispherical and hemicylidrical structures from non-spherically shaped templates

Assignee: LSI Logic Corporation
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Quick Facts
Patent No.
US 6,969,472
App. No.
09/842,214
Granted
Nov 29, 2005
Kind
B2
Abstract

A method for manufacturing hemi-cylindrical and hemi-spherical micro structures is provided. A pattern is formed onto a substrate, and a layer of material is subsequently grown onto the substrate. Due to growth characteristics, the layer will form radially symmetric features when grown to an appropriate thickness.

Claims (34)

1. A method of making a stamper or stamper ancestor for fabricating an optical disk comprising:

forming a single layer substrate having a corrugated upper surface profile;

depositing a layer of material onto said upper surface so as to form a combined substrate and layer structure having an upper surface profile comprising an adjacent series of structures having a substantially hemi-cylindrical contour.

2. The method of claim 1 , wherein said forming comprises grooving a substrate with a spiral groove.

3. The method of claim 1 , wherein said forming comprises depositing, exposing, and developing a photoresist.

4. The method of claim 1 , wherein said forming comprises etching through an exposed and developed photoresist layer.

5. The method of claim 1 , wherein said forming comprises forming a substrate having an approximately sinusoidal upper surface profile.

6. The method of claim 1 , wherein said forming comprises forming a substrate having an approximately rectangular upper surface profile.

7. The method of claim 1 , additionally comprising: depositing metal onto said combined substrate and layer structure; removing said metal to form an inverted replica.

8. A method of making an optical data storage media, said method comprising:

forming a single layer substrate having a corrugated upper surface;

depositing at least one layer of optically active material over said substrate;

depositing a layer of material onto said optically active material so as to form lenses over said optically active material having a substantially hemi-cylindrical contour.

9. The method of claim 8 , wherein said depositing at least one layer of optically active material comprises depositing a phase change stack.

10. The method of claim 8 , additionally comprising bonding a substantially transparent cover sheet onto said lenses.

11. The method of claim 10 , wherein said cover sheet comprises polycarbonate.

12. A method of making an optical data storage medium comprising:

forming one or more convex substantially hemicylindrical structures with a deposition process characterized by substantially uniform growth on a single layer substrate;

serially replicating said structures to form a stamper having one or more convex substantially hemicylindrical structures;

molding a plastic blank using said stamper as part of a mold assembly to form a plastic substrate having one or more concave grooves with a substantially hemicylindrical contour; and

filling said grooves with a dielectric material so as to form convex lenses when viewed from the surface of the plastic blank opposite from the grooved side.

13. The method of claim 12 , wherein said plastic blank comprises polycarbonate.

14. The method of claim 1 , wherein depositing said layer of material comprises vacuum deposition.

15. The method of claim 1 , wherein depositing said layer of material comprises sputter coating said material onto said upper surface under vacuum conditions.

16. The method of claim 1 , wherein depositing said layer of material comprises a process characterized by substantially uniform growth.

17. The method of claim 1 , further comprising:

depositing a separation layer by accumulating inorganic material onto said upper surface.

18. The method of claim 17 , wherein said inorganic material is accumulating by a process selected from the group consisting of sputtering, electroplating, and other deposition technology.

19. The method of claim 1 , wherein said corrugated upper surface profile comprises a profile selected from the group consisting of (i) alternating convex and concave structures, (ii) grooves having an approximately sinusoidal cross section, (iii) grooves having a rectangular cross section, (iv) grooves having a trapezoidal cross section and (v) grooves having a flat sided geometric shape.

20. The method of claim 1 , wherein forming said substrate having a corrugated upper surface profile comprises the steps of:

forming a pattern of photo-sensitive synthetic resin on said substrate using one or more lithographic techniques;

etching said substrate to remove substrate material from between elements of said pattern of photo-sensitive synthetic resin; and

removing said pattern of photo-sensitive synthetic resin.

21. The method of claim 8 , wherein said layer of material deposited onto said optically active material comprises a material selected from the group consisting of gallium phosphide (GaP), gallium arsenide (GaAs), indium phosphide (InP), indium arsenide (InAs), germanium and indium antimonide (InSb).

Assignments (16)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0719 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0608 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
RELEASE OF SECURITY INTEREST Recorded Jun 24, 2004
From: MICROSOFT CAPITAL CORPORATION
To: CALIMETRICS, INC.
Reel/Frame 015442/0620 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2003
From: LSI LOGIC CORPORATION; CALIMETRICS, INC.
To: LSI LOGIC CORPORATION
Reel/Frame 014763/0562 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2003
From: LSI LOGIC CORPORATION; CALIMETRICS, INC.
To: LSI LOGIC CORPORATION
Reel/Frame 014845/0851 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2003
From: LSI LOGIC CORPORATION; CALIMETRICS, INC.
To: LSI LOGIC CORPORATION
Reel/Frame 014734/0956 →
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2003
From: MICROSOFT CAPITAL CORPORATION
To: CALIMETRICS, INC.
Reel/Frame 014709/0813 →
SECURITY INTEREST Recorded Aug 5, 2003
From: CALIMETRICS, INC.
To: MICROSOFT CAPITAL CORPORATION
Reel/Frame 014337/0539 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2001
From: GUERRA, JOHN M.; VEZENOV, DMITRI V.; WAN, LEONARD; SULLIVAN, PAUL F.
To: CALIMETRICS, INC.
Reel/Frame 012380/0625 →
Continuity (2)
Provisional Application 6028549700 · Apr 19, 2001
Related Publication 20020168592A1 · Nov 14, 2002