IP Library Granted Patent US 6,419,572
Granted Patent Utility
US 6,419,572 · Confirmation No. 1814

METHOD AND APPARATUS FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC SUBSTRATES

Inventor: Scott E. Moore
⬇ PDF
Code Description Pages PDF
2001-08-07 TRNA Transmittal of New Application 3 View
2001-08-07 ADS Application Data Sheet 2 View
2001-08-07 A.PE Preliminary Amendment 5 View
2001-08-07 SPEC Specification 14 View
2001-08-07 CLM Claims 17 View
2001-08-07 ABST Abstract 1 View
2001-08-07 DRW Drawings-only black and white line drawings 6 View
2001-08-07 OATH Oath or Declaration filed 4 View
2001-08-07 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,419,572
App. No.
09/924,066
Filed
2001-08-07
Granted
2002-07-16
Pub. No.
US20010049254A1
Art Unit
3723
PTA
0 days