IP Library Granted Patent US 6,652,370
Granted Patent Utility
US 6,652,370 · Confirmation No. 5626

METHOD AND APPARATUS FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC SUBSTRATES

Inventor: Scott E. Moore
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Code Description Pages PDF
2003-08-21 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-21 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2003-08-21 LET. Miscellaneous Incoming Letter 3 View
2002-06-10 TRNA Transmittal of New Application 3 View
2002-06-10 ADS Application Data Sheet 2 View
2002-06-10 A.PE Preliminary Amendment 2 View
2002-06-10 SPEC Specification 14 View
2002-06-10 CLM Claims 17 View
2002-06-10 ABST Abstract 1 View
2002-06-10 DRW Drawings-only black and white line drawings 6 View
2002-06-10 OATH Oath or Declaration filed 10 View
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Quick Facts
Patent No.
US 6,652,370
App. No.
10/167,102
Filed
2002-06-10
Granted
2003-11-25
Pub. No.
US20020173171A1
Art Unit
3723
PTA
-102 days