Dielectric material forming methods
View Patent ↗A dielectric material forming method includes forming a first monolayer and forming a second monolayer on the first monolayer, one of the first and second monolayers comprising tantalum and oxygen and the other of the first and second monolayers comprising oxygen and another element different from tantalum. A dielectric layer can be formed containing the first and second monolayers. The dielectric layer can exhibit a dielectric constant greater than the first monolayer. The another element can include a Group IB to VIIIB element, such as titanium and/or zirconium. The forming of the first and second monolayer can include atomic layer depositing. A dielectric material can include first and second chemisorbed materials, the second material containing oxygen and a Group IB to VIIIB element and the dielectric material exhibiting a dielectric constant greater than the first chemisorbed material. The dielectric material can further exhibit less current leakage than the first material.
1. A dielectric material forming method comprising:
chemisorbing alternated monolayers of a first dielectric material and a second dielectric material over a substrate; and
providing fewer monolayers of the second material compared to the first material with 2–20% of the monolayers being monolayers of the second material, the first material comprising tantalum and oxygen and the second material comprising oxygen, titanium, and zirconium.
2. The method of claim 1 wherein from about 5% to about 15% of the monolayers are second material monolayers.
3. The method of claim 1 further comprising approximately evenly interspersing the second material monolayers among the first material monolayers.
4. The method of claim 1 further comprising chemisorbing a majority of the second material monolayers on an underlying second material monolayer.
5. The method of claim 1 wherein the first material comprises tantalum pentoxide.
6. The method of claim 1 wherein the chemisorbing of the monolayers comprises atomic layer depositing.
7. The method of claim 1 further comprising annealing the monolayers.
8. A dielectric material forming method comprising:
atomic layer depositing a plurality of monolayers, each of the plurality of monolayers comprising both an oxide of zirconium and tantalum oxide; and
forming a dielectric material comprising the zirconium oxide and the tantalum oxide, the dielectric material exhibiting a dielectric constant greater than that of tantalum oxide and zirconium oxide.
9. An enhanced dielectric material comprising alternated chemisorbed monolayers of a first dielectric material and a second dielectric material over a substrate, the enhanced dielectric material comprising fewer monolayers of the second material compared to the first material with 2–20% of the monolayers being monolayers of the second material, the first material comprising tantalum and oxygen, and the second material comprising oxygen, titanium, and zirconium.
10. The dielectric of claim 9 wherein from about 5% to about 15% of the monolayers are second material monolayers.
11. The dielectric of claim 9 wherein the second material monolayers are approximately evenly interspersed among the first material monolayers.
12. The dielectric of claim 9 wherein a majority of the second material monolayers contact an underlying second material monolayer.
13. The dielectric of claim 9 wherein the first material comprises tantalum pentoxide.