IP Library Granted Patent US 6,901,646
Granted Patent B2
US 6,901,646 · App. 10/052,160 · Granted Jun 7, 2005

Universal snap-fit spacer

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Quick Facts
Patent No.
US 6,901,646
App. No.
10/052,160
Granted
Jun 7, 2005
Kind
B2
Abstract

A universal snap-fit system for interconnecting multiple circuit boards in a stacked relationship is provided. The system allows circuit boards to be stacked with a minimum of assembly time. In addition, the system allows circuit boards of varying thicknesses to be stacked, without requiring the provision of system components in a multitude of sizes. The provided system also allows more than two circuit boards to be interconnected to one another in a stacked relationship without requiring multiple sets of attachment holes in interior circuit boards. In addition, more than two circuit boards can be stacked quickly and easily.

Claims (47)

1. A universal snap-fit spacer system, comprising:

a fastener member, comprising:

a body portion;

at least two resilient portions, wherein said resilient portions comprise stem members, and wherein said fastener member further comprises a gap formed between said stem members; and

a locking assembly, wherein said resilient portion biases said locking assembly into a first position;

a spacer element, comprising:

an interior bore;

a plurality of recesses formed in said interior bore, wherein said locking assembly of said fastener member may be received in any one of a number of said plurality of recesses to prevent said fastener member from being withdrawn from said spacer element.

2. The system of claim 1 , wherein said locking assembly is in said first position when said locking assembly is received in one of said plurality of recesses.

3. The system of claim 1 , wherein in said first position a distance across said locking assembly is equal to a first amount.

4. The system of claim 1 , wherein in a second position a distance across said locking assembly is equal to a second amount, and wherein said second amount is about equal to a diameter of said interior bore.

5. The system of claim 1 , wherein said locking assembly comprises:

at least a first camming surface; and

at least a first locking surface.

6. The system of claim 1 , wherein at least a first recess comprises:

a tapered surface; and

a latching surface.

7. The system of claim 6 , wherein a latching surface of a first of said recesses is a first distance from a latching surface of a second of said recesses, wherein said fastener member comprises a pair of locking assemblies, and wherein a distance between a locking surface of a first of said locking assemblies and a locking surface of a second of said locking assemblies is a distance equal to an integer multiple of said first distance.

8. The system of claim 1 , wherein said spacer element further comprises a plurality of grooves formed in an exterior of said spacer element, and wherein at least a first of said grooves is formed in a plane corresponding to a plane of a latching surface of one of said recesses.

9. The system of claim 1 , wherein said spacer element further comprises a plurality of depth control holes, wherein a depth control rod can be inserted in one of said depth control holes to prevent the fastener member from being inserted into said spacer element past a predetermined depth.

10. The system of claim 1 , wherein said plurality of recesses are axially aligned with one another.

11. A method for interconnecting objects, comprising:

interconnecting a first snap fit fastener member to a first object, wherein said first snap fit fastener member has substantially identical first and second ends;

interconnecting said first snap fit fastener member to a spacer element;

interconnecting a second snap fit fastener member to a second object, wherein said second snap fit fastener member has substantially identical first and second ends;

interconnecting said second snap fit fastener member to said spacer element, wherein said first and second objects are fastened to one another, wherein each of said first and second objects are in contact with said spacer element, and wherein said first snap fit fastener member is substantially identical to said second snap fit fastener member.

12. The method of claim 11 , further comprising:

interconnecting said second snap fit fastener member to a second spacer element;

interconnecting a third snap fit fastener member to a third object;

interconnecting said third snap fit fastener member to said second spacer element, wherein said first, second, and third objects are fastened to one another.

13. The method of claim 11 , wherein said first and second objects comprise first and second circuit boards respectively.

14. The method of claim 13 , wherein said first circuit board is a first thickness, and wherein said second circuit board is a second thickness.

15. The method of claim 11 , wherein said spacer element comprises a plurality of recesses, wherein said fastener members comprise at least a first fastener assembly, wherein said first fastener member engages a recess at a first distance from a first end of said spacer element.

16. The method of claim 15 , wherein said second member engages a recess at a second distance from a second end of said spacer element, and wherein said first and second objects are different thicknesses.

17. A system for stacking circuit boards, comprising:

a first fastener member;

a first spacer clement comprising an interior bore and a plurality of interior recesses;

a first circuit board, wherein a first locking assembly at a first end of said first fastener member is snap fit to said first circuit board and a second locking assembly at a second end of said first fastener member is snap fit to said first spacer element, wherein said first circuit board is held between said first locking assembly of said first fastener member and a first end of said spacer element;

a second fastener member;

a second circuit board, wherein a first locking assembly at a first end of said second fastener member is snap fit to said first circuit board and a second locking assembly at a second end of said second fastener member is snap fit to said first spacer element, and wherein said second circuit board is in a stacked relationship with said second circuit board.

18. The system of claim 17 , wherein said first circuit board is a first thickness, and wherein said second locking assembly at a second end of said first fastener member is engaged with a first recess of said first spacer element located a first distance from said first end of said first spacer element.

19. The system of claim 18 , wherein said second circuit board is a second thickness, and wherein said second locking assembly at a second end of said second fastener member is engaged with a second recess of said first spacer element located a second distance from said second end of said first spacer element.

20. The system of claim 17 , wherein said second circuit board is held between said first looking assembly of said second fastener member and a second end of said first spacer element.

21. The system of claim 17 , further comprising:

a second spacer clement, wherein said second locking assembly at a second end of said second fastener member is snap fit to said second spacer element, wherein said second circuit board is held between a second end of said first spacer element and a first end of said second spacer element;

a third fastener member;

a third circuit board, wherein a first locking assembly at a first end of said third fastener member is snap fit to said third circuit board and a second locking assembly at a second end of said third fastener member is snap fit to said second spacer element, wherein said third circuit board is held between said first locking assembly of said third fastener member and a second end of said second spacer element.

Assignments (20)
RELEASE OF SECURITY INTEREST IN PATENTS (REEL/FRAME 53955/0436) Recorded May 18, 2023
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: AVAYA MANAGEMENT L.P.; AVAYA INC.; INTELLISIST, INC.; AVAYA INTEGRATED CABINET SOLUTIONS LLC
Reel/Frame 063705/0023 →
RELEASE OF SECURITY INTEREST IN PATENTS (REEL/FRAME 045034/0001) Recorded May 18, 2023
From: GOLDMAN SACHS BANK USA., AS COLLATERAL AGENT
To: AVAYA INC.; INTELLISIST, INC.; AVAYA INTEGRATED CABINET SOLUTIONS LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.; ZANG, INC. (FORMER NAME OF AVAYA CLOUD INC.); HYPERQUALITY, INC.; HYPERQUALITY II, LLC; CAAS TECHNOLOGIES, LLC; AVAYA MANAGEMENT L.P.
Reel/Frame 063779/0622 →
RELEASE OF SECURITY INTEREST IN PATENTS AT REEL 45124/FRAME 0026 Recorded Apr 26, 2023
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: AVAYA HOLDINGS CORP.; AVAYA INC.; AVAYA MANAGEMENT L.P.; AVAYA INTEGRATED CABINET SOLUTIONS LLC
Reel/Frame 063457/0001 →
SECURITY INTEREST Recorded Sep 25, 2020
From: AVAYA INC.; AVAYA MANAGEMENT L.P.; INTELLISIST, INC.; AVAYA INTEGRATED CABINET SOLUTIONS LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 053955/0436 →
SECURITY INTEREST Recorded Jan 23, 2018
From: AVAYA INC.; AVAYA INTEGRATED CABINET SOLUTIONS LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.; ZANG, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 045124/0026 →
SECURITY INTEREST Recorded Jan 10, 2018
From: AVAYA INC.; AVAYA INTEGRATED CABINET SOLUTIONS LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.; ZANG, INC.
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 045034/0001 →
RELEASE OF SECURITY INTEREST Recorded Jan 9, 2018
From: CITICORP USA, INC.
To: AVAYA, INC.; SIERRA HOLDINGS CORP.; AVAYA TECHNOLOGY, LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.
Reel/Frame 045032/0213 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 025863/0535 Recorded Dec 15, 2017
From: THE BANK OF NEW YORK MELLON TRUST, NA
To: AVAYA INC.
Reel/Frame 044892/0001 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 012759/0141 Recorded Dec 15, 2017
From: THE BANK OF NEW YORK
To: AVAYA INC. (FORMERLY KNOWN AS AVAYA TECHNOLOGY CORP.)
Reel/Frame 044891/0439 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 041576/0001 Recorded Dec 15, 2017
From: CITIBANK, N.A.
To: AVAYA INC.; AVAYA INTEGRATED CABINET SOLUTIONS INC.; OCTEL COMMUNICATIONS LLC (FORMERLY KNOWN AS OCTEL COMMUNICATIONS CORPORATION); VPNET TECHNOLOGIES, INC.
Reel/Frame 044893/0531 →
BANKRUPTCY COURT ORDER RELEASING ALL LIENS INCLUDING THE SECURITY INTEREST RECORDED AT REEL/FRAME 030083/0639 Recorded Dec 15, 2017
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: AVAYA INC.
Reel/Frame 045012/0666 →
SECURITY INTEREST Recorded Jan 27, 2017
From: AVAYA INC.; AVAYA INTEGRATED CABINET SOLUTIONS INC.; OCTEL COMMUNICATIONS CORPORATION; VPNET TECHNOLOGIES, INC.
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041576/0001 →
SECURITY AGREEMENT Recorded Mar 13, 2013
From: AVAYA, INC.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 030083/0639 →
SECURITY AGREEMENT Recorded Feb 22, 2011
From: AVAYA INC., A DELAWARE CORPORATION
To: BANK OF NEW YORK MELLON TRUST, NA, AS NOTES COLLATERAL AGENT, THE
Reel/Frame 025863/0535 →
CONVERSION FROM CORP TO LLC Recorded Dec 29, 2008
From: AVAYA TECHNOLOGY CORP.
To: AVAYA TECHNOLOGY LLC
Reel/Frame 022071/0420 →
REASSIGNMENT Recorded Jun 27, 2008
From: AVAYA TECHNOLOGY LLC
To: AVAYA INC
Reel/Frame 021158/0319 →
SECURITY AGREEMENT Recorded Nov 28, 2007
From: AVAYA, INC.; AVAYA TECHNOLOGY LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.
To: CITICORP USA, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 020166/0705 →
SECURITY AGREEMENT Recorded Nov 27, 2007
From: AVAYA, INC.; AVAYA TECHNOLOGY LLC; OCTEL COMMUNICATIONS LLC; VPNET TECHNOLOGIES, INC.
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 020156/0149 →
SECURITY AGREEMENT Recorded Apr 9, 2002
From: AVAYA TECHNOLOGY CORP.
To: BANK OF NEW YORK, THE
Reel/Frame 012759/0141 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2002
From: YOON, WOONG K.
To: AVAYA TECHNOLOGY CORP.
Reel/Frame 012528/0504 →