IP Library › Granted Patent US 6,622,907
Granted Patent Utility
US 6,622,907 · Confirmation No. 4572

SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS

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 Code Description Pages PDF
2003-07-16 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-16 C.AD Change of Address 1 View
2002-02-19 TRNA Transmittal of New Application 1 View
2002-02-19 SPEC Specification 21 View
2002-02-19 CLM Claims 7 View
2002-02-19 ABST Abstract 1 View
2002-02-19 DRW Drawings-only black and white line drawings 10 View
2002-02-19 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,622,907
App. No.
10/078,948
Filed
2002-02-19
Granted
2003-09-23
Pub. No.
US20030155408A1
Art Unit
1725
PTA
0 days