Electronic component with a semiconductor chip and method of producing an electronic component
View Patent ↗An electronic component includes a semiconductor chip which has an active upper side and a passive rear side. The semiconductor chip is surrounded by a sawn edge. This edge of semiconductor material has profile-sawn contours. The profile-sawn contours are surrounded by a plastics composition forming an edge of plastic. The plastics composition is in form-locking engagement with the profile-sawn contours. A method of producing a component of this type is also provided.
1. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side with a central portion and edge portions, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having non-straight profile-sawn contours extending into said edge portions of said active upper side; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said central portion of said active upper side being uncovered by said plastics composition.
2. The electronic component according to claim 1 , wherein said plastic edge has a cross section formed with a notch at said active upper side.
3. The electronic component according to claim 1 , including an adhesion-promoting layer provided between said sawn edge and said plastics composition.
4. The electronic component according to claim 3 , wherein said adhesion-promoting layer includes at least one element selected from the group consisting of a zinc oxide and a chromium oxide.
5. The electronic component according to claim 1 , wherein said active upper side of said semiconductor chip includes an integrated circuit.
6. The electronic component according to claim 1 , wherein said active upper side of said semiconductor chip includes a contact sensor.
7. The electronic component according to claim 1 , wherein said plastic edge has a cross section formed with a notch at said passive rear side.
8. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawn contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a rectangular cross section which is extended, toward said active upper side of said semiconductor chip, by a triangular area tapering to a point.
9. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawm contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a rectangular cross section with an additional rectangular area widening said rectangular cross section toward said active upper side of said semiconductor chip.
10. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawn contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a U-shaped cross section with a relatively shorter leg and a relatively longer leg; and
said active upper side of said semiconductor chip having an edge region with a groove formed therein, said relatively shorter leg engaging in said groove, and said relatively longer leg forming an outer edge of said plastic edge.
11. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawn contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a rectangular cross section which is extended, toward said passive rear side of said semiconductor chip, by a triangular area tapering to a point.
12. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawn contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a rectangular cross section with an additional rectangular area widening said rectangular cross section toward said passive rear side of said semiconductor chip.
13. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip, said sawn edge having profile-sawn contours; and
a plastics composition forming a plastic edge, said plastic edge surrounding said sawn edge and being in a form-locking engagement with said profile-sawn contours;
said plastic edge having a U-shaped cross section with a relatively shorter leg and a relatively longer leg; and
said passive rear side of said semiconductor chip having an edge region with a groove formed therein, said relatively shorter leg engaging in said groove, and said relatively longer leg forming an outer edge of said plastic edge.
14. An electronic component, comprising:
a semiconductor chip including a semiconductor material, said semiconductor chip having an active upper side with an edge portion, a passive rear side, and a sawn edge;
said sawn edge being formed of said semiconductor material and surrounding said semiconductor chip; and
said sawn edge having non-straight profile-sawn contours extending into said edge portion of said active upper side.