Flip-chip micromachine package using seal layer

1. A package comprising:

a substrate comprising a first surface;

a micromachine chip comprising a first surface comprising a micromachine area; and

a seal layer forming a seal between a peripheral region of said first surface of said substrate and a peripheral region of said first surface of said micromachine chip.

2. The package of claim 1 wherein said micromachine chip further comprises bond pads on said first surface of said micromachine chip.

3. The package of claim 2 further comprising:

traces on said first surface of said substrate; and

columns electrically coupling said bond pads to said traces.

4. The package of claim 3 wherein said columns comprise:

bumps; and

plugs.

5. The package of claim 4 wherein said plugs comprise compressed regions of said seal layer.

6. The package of claim 5 wherein said seal layer is pushed away from said columns to fill any gaps between said peripheral region of said first surface of said substrate and said peripheral region of said first surface of said micromachine chip.

7. The package of claim 3 wherein said columns comprise bumps coupled to said bond pads and said traces.

8. The package of claim 7 wherein said bumps penetrate and pass through said seal layer from said bond pads to said traces.

9. The package of claim 1 wherein a surface of said seal layer and a central region of said first surface of said micromachine chip define a cavity, said micromachine area being located within said cavity.

10. The package of claim 9 wherein said substrate further comprises at least one vent extending to said seal layer directly opposite of said cavity.

11. The package of claim 10 wherein said at least one vent extends through said substrate from said first surface of said substrate to a second surface of said substrate.

12. The package of claim 1 wherein said seal layer comprises an anisotropic conductive film (ACF).

13. The package of claim 1 further comprising a substrate spacer layer on said first surface of said substrate.

14. The package of claim 1 further comprising a micromachine spacer layer on said first surface of said micromachine chip.

15. A package comprising:

a micromachine chip comprising:

a first surface; and

a micromachine area comprising a micromachine element on said first surface; a substrate comprising:

a first surface;

a second surface; and

at least one vent extending through said substrate from said first surface of said substrate to said second surface; and

a seal layer between said first surface of said micromachine chip and said first surface of said substrate, wherein said at least one vent extends to a first surface of said seal layer directly opposite of a cavity defined by a second surface of said seal layer and said first surface of said micromachine chip.

16. The package of claim 15 wherein said micromachine area is located within said cavity.

17. The package of claim 15 further comprising:

bond pads on said first surface of said micromachine chip;

traces on said first surface of said substrate;

columns electrically coupling said bond pads to said traces comprising:

bumps; and

compressed regions of said seal layer.

18. A method comprising:

forming at least one vent in a substrate;

applying vacuum to said at least one vent;

pressing a seal layer on to said substrate and said at least one vent to shape said seal layer; and

mounting a micromachine chip to said substrate with said seal layer.

19. The method of claim 18 further comprising forming bumps on bond pads of said micromachine chip using a dry process.

20. The method of claim 19 further comprising forming electrically conductive plugs by compressing regions of said seal layer with said bumps.