IP Library Granted Patent US 6,593,228
Granted Patent Utility
US 6,593,228 · Confirmation No. 5660

METHOD OF FABRICATING A PATTERNED METAL-CONTAINING LAYER ON A SEMICONDUCTOR WAFER

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Code Description Pages PDF
2002-04-12 TRNA Transmittal of New Application 2 View
2002-04-12 SPEC Specification 17 View
2002-04-12 CLM Claims 4 View
2002-04-12 ABST Abstract 1 View
2002-04-12 DRW Drawings-only black and white line drawings 2 View
2002-04-12 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,593,228
App. No.
10/122,936
Filed
2002-04-12
Granted
2003-07-15
Pub. No.
US20020160596A1
Art Unit
2814
PTA
-8 days