IP Library › Granted Patent US 6,642,066
Granted Patent Utility
US 6,642,066 · Confirmation No. 8886

INTEGRATED PROCESS FOR DEPOSITING LAYER OF HIGH-K DIELECTRIC WITH IN-SITU CONTROL OF K VALUE AND THICKNESS OF HIGH-K DIELECTRIC LAYER

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2003-08-04 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-05-15 TRNA Transmittal of New Application 3 View
2002-05-15 SPEC Specification 25 View
2002-05-15 CLM Claims 4 View
2002-05-15 ABST Abstract 1 View
2002-05-15 DRW Drawings-only black and white line drawings 3 View
2002-05-15 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,642,066
App. No.
10/145,942
Filed
2002-05-15
Granted
2003-11-04
Art Unit
2812
PTA
0 days