IP Library Granted Patent US 6,838,212
Granted Patent B2
US 6,838,212 · App. 10/165,911 · Granted Jan 4, 2005

Method for producing scatter lines in mask structures for fabricating integrated electrical circuits

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Quick Facts
Patent No.
US 6,838,212
App. No.
10/165,911
Granted
Jan 4, 2005
Kind
B2
Abstract

In the method according to the invention, scatter lines ( 2, 3, 4, 5, 6, 7, 8 ) with a predetermined width are produced, which run at a predetermined distance from selected edges of mask structure elements ( 1 ). These scatter lines ( 2, 3, 4, 5, 6, 7, 8 ) produced are inspected with regard to compliance with a predetermined distance from adjoining edges of mask structure elements ( 1 ) and with regard to compliance with a predetermined distance from one another. Scatter lines ( 2, 3, 4, 5, 6, 7, 8 ) which fall below the predetermined distance are shortened and/or eliminated.

Claims (28)

1. A method for producing scatter lines in at least one mask structure present as a file in which the mask structure has mask structure elements on a mask plane and the mask structure is for fabricating integrated electrical circuits, the method which comprises:

step 1) determining edges or edge pairs bounding the mask structure elements on the mask plane, and producing scatter lines parallel to the edges or edge pairs, depending on a respective distance from other mask structure elements;

step 2) producing scatter lines as narrow rectangles having predetermined distances and predetermined widths such that the scatter lines run beside the edges determined in step 1 or run centrally between the edge pairs determined in step 1, the scatter lines having lengths corresponding to lengths of the edges, which are associated with the scatter lines;

step 3) inspecting the scatter lines produced in step 2 to determine whether the scatter lines produced in step 2 comply with a first predetermined distance from the original mask structure elements, and shortening or eliminating ones of the scatter lines produced in step 2 falling below the first predetermined distance; and

step 4) pairwise inspecting the scatter lines produced in step 2 and in step 3 to determine whether the scatter lines produced in step 2 and in step 3 comply with a second predetermined distance from one another, and shortening or eliminating ones of the scatter lines produced in step 2 and in step 3 falling below the second predetermined distance.

2. The method according to claim 1 , wherein step 2 includes producing a plurality of scatter lines in parallel with and at different distances from a respective one of the edges.

3. The method according to claim 1 , wherein step 2 includes producing one or more centrally running scatter lines between parallel running edges of ones of the mask structure elements.

4. The method according to claim 1 , which comprises prescribing a minimum length for the scatter lines; and when correcting adjacent ones of the scatter lines, not considering scatter lines that will be eliminated for falling below the minimum length.

5. A computerized method for producing scatter lines in at least one mask structure present as a file in which the mask structure has mask structure elements on a mask plane and the mask structure is for fabricating integrated electrical circuits, the method which comprises:

step 1) determining edges or edge pairs bounding the mask structure elements on the mask plane, and producing scatter lines parallel to the edges or edge pairs, depending on a respective distance from other mask structure elements;

step 2) producing scatter lines as narrow rectangles having predetermined distances and predetermined widths such that the scatter lines run beside the edges determined in step 1 or run centrally between the edge pairs determined in step 1, the scatter lines having lengths corresponding to lengths of the edges, which are associated with the scatter lines;

step 3) inspecting the scatter lines produced in step 2 to determine whether the scatter lines produced in step 2 comply with a first predetermined distance from the original mask structure elements, and shortening or eliminating ones of the scatter lines produced in step 2 failing below the first predetermined distance; and

step 4) pairwise inspecting the scatter lines produced in step 2 and in step 3 to determine whether the scatter lines produced in step 2 and in step 3 comply with a second predetermined distance from one another, and shortening or eliminating ones of the scatters lines produced in step 2 and in step 3 falling below the second predetermined distance.

6. A computer readable medium having computer-executable instructions for:

receiving an input file including at least one mask structure; and

performing a method for producing scatter lines in the mask structure in which the mask structure has mask structure elements on a mask plane and the mask structure is for fabricating integrated electrical circuits, the method which comprises:

step 1) determining edges or edge pairs bounding the mask structure elements on the mask plane, and producing scatter lines parallel to the edges or edge pairs, depending on a respective distance from other mask structure elements;

step 2) producing scatter lines as narrow rectangles having predetermined distances and predetermined widths such that the scatter lines run beside the edges determined in step 1 or run centrally between the edge

pairs determined in step 1, the scatter lines having lengths corresponding to lengths of the edges, which are associated with the scatter lines;

step 3) inspecting the scatter lines produced in step 2 to determine whether the scatter lines produced in step 2 comply with a first predetermined distance from the original mask structure elements, and shortening or eliminating ones of the scatter lines produced in step 2 falling below the first predetermined distance;

step 4) pairwise inspecting the scatter lines produced in step 2 and in step 3 to determine whether the scatter lines produced in step 2 and in step 3 comply with a second predetermined distance from one another, and shortening or eliminating ones of the scatter lines produced in step 2 and in step 3 falling below the second predetermined distance; and

step 5) prescribing a minimum length for the scatter lines; and when correcting adjacent ones of the scatter lines, not considering scatter lines that will be eliminated for falling below the minimum length.

7. A method for producing scatter lines in at least one mask structure present as a file in which the mask structure has mask structure elements on a mask plane and the mask structure is for fabricating integrated electrical circuits, the method which comprises downloading computer-executable instructions from an electronic data network to a computer connected to the data network, the computer-executable instructions being for:

step 1) determining edges or edge pairs bounding the mask structure elements on the mask plane, and producing scatter lines parallel to the edges or edge pairs, depending on a respective distance from other mask structure elements;

step 2) producing scatter lines as narrow rectangles having predetermined distances and predetermined widths such that the scatter lines run beside the edges determined in step 1 or run centrally between the edge pairs determined in step 1, the scatter lines having lengths corresponding to lengths of the edges, which are associated with the scatter lines;

step 3) inspecting the scatter lines produced in step 2 to determine whether the scatter lines produced in step 2 comply with a first predetermined distance from the original mask structure elements, and shortening or eliminating ones of the scatter lines produced in step 2 falling below the first predetermined distance;

step 4) pairwise inspecting the scatter lines produced in step 2 and in step 3 to determine whether the scatter lines produced in step 2 and in step 3 comply with a second predetermined distance from one another, and shortening or eliminating ones of the scatter lines produced in step 2 and in step 3 falling below the second predetermined distance; and

step 5) prescribing a minimum length for the scatter lines, and when correcting adjacent ones of the scatter lines, not considering scatter lines that will be eliminated for falling below the minimum length.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036575/0368 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023828/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2004
From: MEIER, INGRID (HEIR TO WOLFGANG MEIER) DECEASED; MEIER, BERND (HEIR TO WOLFGANG MEIER) DECEASED
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016019/0391 →