IP Library › Granted Patent US 6,566,268
Granted Patent Utility
US 6,566,268 · Confirmation No. 9002

METHOD AND APPARATUS FOR PLANARIZING A WAFER SURFACE OF A SEMICONDUCTOR WAFER HAVING AN ELEVATED PORTION EXTENDING THEREFROM

Inventor: John Gregory
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 Code Description Pages PDF
2022-04-15 OATH Oath or Declaration filed 252 View
2003-11-12 WFEE Fee Worksheet (SB06) 1 View
2002-07-25 TRNA Transmittal of New Application 3 View
2002-07-25 ADS Application Data Sheet 3 View
2002-07-25 SPEC Specification 19 View
2002-07-25 CLM Claims 3 View
2002-07-25 ABST Abstract 1 View
2002-07-25 DRW Drawings-only black and white line drawings 6 View
2002-07-25 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,566,268
App. No.
10/205,229
Filed
2002-07-25
Granted
2003-05-20
Art Unit
1763
PTA
0 days