Field effect transistor and method of manufacturing same
View Patent ↗A field effect transistor includes a drain region ( 12 ) having a first portion ( 18 ) and a second portion ( 20 ), with the second portion being more lightly doped than the first portion. A channel region ( 14 ) is adjacent to the second portion and a drain electrode ( 24 ) overlies the drain region. A gate electrode ( 16 ) overlies the channel region. A shield structure ( 30 ) overlies the drain region and has a first section ( 32 ) at a first distance ( 33 ) from a semiconductor substrate ( 10 ) and a second section ( 34 ) at a second distance ( 35 ) from the semiconductor substrate, the second distance being greater than the first distance. In a particular embodiment the FET includes a shield structure wherein the first and second sections are physically separate. The location of these shield sections may be varied within the FET, and the potential of each section may be independently controlled.
1. A field effect transistor comprising:
a semiconductor substrate having a surface;
a drain region in the semiconductor substrate and having a first portion and a second portion more lightly doped than the first portion;
a channel region in the semiconductor substrate and adjacent to the second portion of the drain region;
a gate electrode overlying the channel region and located over the surface of the semiconductor substrate;
a drain electrode overlying the first portion of the drain region and located over the surface of the semiconductor substrate; and
an electrically conductive shield structure overlying the second portion of the drain region,
wherein:
the electrically conductive shield structure comprises:
a first section at a first distance from the semiconductor substrate; and
a second section at a second distance from the semiconductor substrate and at a third distance from the gate electrode;
at least a portion of the electrically conductive shield structure overlies at least a portion of the gate electrode;
the first section and the second section are electrically biased;
the second distance is greater than the first distance;
the third distance is greater than the first distance; and
the drain electrode is closer to the second section of the electrically conductive shield structure than to the first section of the electrically conductive shield structure.
2. A field effect transistor comprising:
a semiconductor substrate;
a drain region in the semiconductor substrate and having a first portion and a second portion more lightly doped than the first portion;
a channel region in the semiconductor substrate and adjacent to the second portion of the drain region;
a gate electrode overlying the channel region;
a drain electrode overlying the first portion of the drain region; and
an electrically conductive shield structure overlying the second portion of the drain region, having a first section at a first distance from the semiconductor substrate, and having a second section at a second distance from the semiconductor substrate, the second distance greater than the first distance,
wherein:
the first and second sections of the electrically conductive shield structure are separately biased;
the first section of the electrically conductive shield structure is electrically coupled to a predetermined potential approximately equal to a threshold voltage for the field effect transistor; and
the second section of the electrically conductive shield structure is electrically coupled to a ground potential.
3. A field effect transistor comprising:
a semiconductor substrate having a surface;
a drain region in the semiconductor substrate and having a first portion and a second portion more lightly doped than the first portion;
a channel region in the semiconductor substrate and adjacent to the second portion of the drain region;
a gate electrode over the surface of the semiconductor substrate and over the channel region;
a drain electrode over the surface of the semiconductor substrate and over the first portion of the drain region; and
an electrically conductive shield structure having a first section and a second section,
wherein:
the first section and the second section of the electrically conductive shield structure are electrically biased;
the first section of the electrically conductive shield structure is over the second portion of the drain region;
the first section of the electrically conductive shield structure is at a first distance from the surface of the semiconductor substrate;
the second section of the electrically conductive shield structure is over the gate electrode;
the second section of the electrically conductive shield structure is at a second distance from the surface of the semiconductor substrate and at a third distance from the gate electrode;
the first and second distances are measured along paths perpendicular to the surface of the semiconductor substrate;
the first distance is less than the second distance;
the third distance is greater than the first distance;
the third distance is less than the second distance; and
the drain electrode is closer to the second section of the electrically conductive shield structure than the first section of the electrically conductive shield structure.
4. A field effect transistor comprising:
a semiconductor substrate having a surface;
a drain region in the semiconductor substrate and having a first portion and a second portion more lightly doped than the first portion;
a channel region in the semiconductor substrate and adjacent to the second portion of the drain region;
a gate electrode over the surface of the semiconductor substrate and over the channel region;
a drain electrode over the surface of the semiconductor substrate and over the first portion of the drain region; and
an electrically conductive shield structure having a first section and a second section,
wherein:
the first section and the second section of the electrically conductive shield structure are electrically biased;
the first section of the electrically conductive shield structure is over the second portion of the drain region;
the first section of the electrically conductive shield structure is at a first distance from the surface of the semiconductor substrate;
the second section of the electrically conductive shield structure is over the gate electrode;
the second section of the electrically conductive shield structure is at a second distance from the surface of the semiconductor substrate and at a third distance from the gate electrode;
the first and second distances are measured along paths perpendicular to the surface of the semiconductor substrate;
the first distance is less than the second distance;
the third distance is greater than the first distance;
the third distance is less than the second distance;
the second section of the electrically conductive shield structure is also over the first section of the electrically conductive shield structure; and
the drain electrode is closer to the second section of the electrically conductive shield structure than the first section of the electrically conductive shield structure.
5. A field effect transistor comprising:
a semiconductor substrate having a surface;
a drain region in the semiconductor substrate and having a first portion and a second portion more lightly doped than the first portion;
a channel region in the semiconductor substrate and adjacent to the second portion of the drain region;
a gate electrode over the surface of the semiconductor substrate and over the channel region;
a drain electrode over the surface of the semiconductor substrate and over the first portion of the drain region; and
an electrically conductive shield structure having a first section and a second section,
wherein:
the first section of the electrically conductive shield structure is over the second portion of the drain region;
the first section of the electrically conductive shield structure is t a first distance from the surface of the semiconductor substrate;
the second section of the electrically conductive shield structure is over the gate electrode;
the second section of the electrically conductive shield structure is at a second distance from the surface of the semiconductor substrate;
the first distance is less than the second distance;
the first section of the electrically conductive shield structure is electrically coupled to a predetermined potential approximately equal to a threshold voltage for the field effect transistor; and
the second section of the electrically conductive shield structure is electrically coupled to a ground potential.