Patent Application
Utility
App. No. 10/223,226
· Confirmation No. 7264
METHOD FOR PRODUCING FLAT WAFER CHUCKS
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2009-04-24 | SRNT |
Examiner's search strategy and results | 1 | View | |
| 2003-10-16 | IFEE |
Issue Fee Payment (PTO-85B) | 2 | View | |
| 2002-08-16 | TRNA |
Transmittal of New Application | 3 | View | |
| 2002-08-16 | SPEC |
Specification | 8 | View | |
| 2002-08-16 | CLM |
Claims | 2 | View | |
| 2002-08-16 | ABST |
Abstract | 1 | View | |
| 2002-08-16 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2002-08-16 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Albert Wang
Moraga, CA
Robert Tseng Shiung Chen
El Sobrante, CA
Attorneys & Agents of Record
Classification
USPC
219/444.1
H10P72/0432
Y10T29/49082
Prosecution
- Examiner
- PAIK, SANG YEOP
- Art Unit
- 3761
- Customer No.
- 20995
- Docket No.
- MATRIX.012DV1
- Confirmation No.
- 7264
Publication
- Pub. No.
- US20020195440A1
- Pub. Date
- 2002-12-26
Patent Term Adjustment
-1days
from
SILICON VALLEY BANK
TERMINATION OF SECURITY AGREEMENT
Recorded 2013-04-16
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2012-12-21
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2004-01-13
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Quick Facts
- App. No.
- 10/223,226
- Filed
- 2002-08-16
- Granted
- 2003-12-09
- Pub. No.
- US20020195440A1
- Examiner
- PAIK, SANG YEOP
- Art Unit
- 3761
- PTA
- -1 days
External Links