Patent Assignment
Reel/Frame 030302/0719
TERMINATION OF SECURITY AGREEMENT
Recorded: 2013-04-16
Received: 2013-04-22
Pages: 7
Assignor
SILICON VALLEY BANK
Executed: 2013-04-11
Assignee
AXCELIS TECHNOLOGIES, INC.
108 CHERRY HILL DRIVE, BEVERLY, MA, 01905, UNITED STATES
Covered Applications
(38)
PLASMA MEDIATED ASHING PROCESSES
App. No. 13/117,488
→
SURGE CURRENT SENSOR AND SURGE PROTECTION SYSTEM INCLUDING THE SAME
PCTPCTUS2011036500
→
FLUID DISTRIBUTION MEMBERS AND/OR ASSEMBLIES
App. No. 13/051,713
→
PLASMA MEDIATED ASHING PROCESSES
App. No. 12/844,193
→
METHOD AND SYSTEM FOR DETECTION OF SOLID MATERIALS IN A PLASMA USING AN ELECTROMAGNETIC CIRCUIT
App. No. 12/843,175
→
THERMAL ISOLATION ASSEMBLIES FOR WAFER TRANSPORT APPARATUS AND METHODS OF USE THEREOF
App. No. 12/694,597
→
Substantially Non-Oxidizing Plasma Treatment Devices and Processes
App. No. 12/631,117
→
TUNING HARDWARE FOR PLASMA ASHING APPARATUS AND METHODS OF USE THEREOF
App. No. 12/621,136
→
PLASMA ASHING APPARATUS AND ENDPOINT DETECTION PROCESS
App. No. 12/552,316
→
PLASMA MEDIATED ASHING PROCESSES THAT INCLUDE FORMATION OF A PROTECTIVE LAYER BEFORE AND/OR DURING THE PLASMA MEDIATED ASHING PROCESS
App. No. 12/398,390
→
SEALED ELECTRICAL CONNECTOR
App. No. 12/225,523
→
FRONT END OF LINE PLASMA MEDIATED ASHING PROCESSES AND APPARATUS
App. No. 12/275,394
→
WIDE AREA RADIO FREQUENCY PLASMA APPARATUS FOR PROCESSING MULTIPLE SUBSTRATES
App. No. 11/635,227
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PROCESSES FOR MONITORING THE LEVELS OF OXYGEN AND/OR NITROGEN SPECIES IN A SUBSTANTIALLY OXYGEN AND NITROGEN-FREE PLASMA ASHING PROCESS
App. No. 11/386,327
→
APPARATUS AND PLASMA ASHING PROCESS FOR INCREASING PHOTORESIST REMOVAL RATE
App. No. 11/217,247
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IN-SITU ABSOLUTE MEASUREMENT PROCESS AND APPARATUS FOR FILM THICKNESS, FILM REMOVAL RATE, AND REMOVAL ENDPOINT PREDICTION
App. No. 11/053,731
→
HYDROCARBON DIELECTRIC HEAT TRANSFER FLUIDS FOR MICROWAVE PLASMA GENERATORS
App. No. 10/937,946
→
Multi-piece baffle plate assembly for a plasma processing system
App. No. 10/836,516
→
METHOD AND SYSTEM FOR DETECTION OF SOLID MATERIALS IN A PLASMA USING AN ELECTROMAGNETIC CIRCUIT
App. No. 10/708,251
→
HELIX COUPLED REMOTE PLASMA SOURCE
App. No. 10/766,973
→
GAS DISTRIBUTION PLATE ASSEMBLY FOR PLASMA REACTORS
App. No. 10/755,617
→
METHOD AND APPARATUS FOR MICRO-JET ENABLED, LOW-ENERGY ION GENERATION AND TRANSPORT IN PLASMA PROCESSING
App. No. 10/752,906
→
PLASMA ASHING PROCESS
App. No. 10/638,570
→
PLASMA APPARATUS, GAS DISTRIBUTION ASSEMBLY FOR A PLASMA APPARATUS AND PROCESSES THEREWITH
App. No. 10/249,962
→
ACTIVELY-COOLED DISTRIBUTION PLATE FOR REDUCING REACTIVE GAS TEMPERATURE IN A PLASMA PROCESSING SYSTEM
App. No. 10/404,510
→
PLASMA ASHING PROCESS FOR REMOVING PHOTORESIST AND RESIDUES DURING FERROELECTRIC DEVICE FABRICATION
App. No. 10/248,707
→
CHEMICAL PLASMA CATHODE
App. No. 10/336,270
→
METHOD FOR PRODUCING FLAT WAFER CHUCKS
App. No. 10/223,226
→
METHOD FOR INCREASED WORKPIECE THROUGHPUT
App. No. 10/170,621
→
REACTOR ASSEMBLY AND PROCESSING METHOD
App. No. 10/071,908
→
PLASMA PROCESS AND APPARATUS
App. No. 10/004,523
→
DIGITAL FOCUS AND TRACKING SERVO SYSTEM WITH MULTI-ZONE CALIBRATION
App. No. 09/950,398
→
PLASMA ASHING PROCESS
App. No. 09/911,682
→
METHOD AND APPARATUS FOR MICRO-JET ENABLED, LOW-ENERGY ION GENERATION AND TRANSPORT IN PLASMA PROCESSING
App. No. 09/905,043
→
SHALLOW ANGLE INTERFERENCE PROCESS AND APPARATUS FOR DETERMINING REAL-TIME ETCHING RATE
App. No. 09/905,032
→
OXYGEN FREE PLASMA STRIPPING PROCESS
App. No. 09/876,318
→
PLASMA PROCESS FOR REMOVING POLYMER AND RESIDUES FROM SUBSTRATES
App. No. 09/864,003
→
PLASMA ASHING PROCESS
App. No. 09/855,177
→