IP Library Granted Patent US 8,906,195
Granted Patent B2
US 8,906,195 · App. 12/621,136 · Granted Dec 9, 2014

Tuning hardware for plasma ashing apparatus and methods of use thereof

Inventors: Aseem K. Srivastava (Andover, MA); Robert P. Couilliard (Plaistow, NH)
Assignee: Lam Research Corporation
H01J37/32192H01J37/32256
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Quick Facts
Patent No.
US 8,906,195
App. No.
12/621,136
Granted
Dec 9, 2014
Kind
B2
Abstract

A continuously variable microwave circuit capable of being tuned to operate under a plurality of distinct operating conditions, comprising: a waveguide comprising an adjustable tuning element having a core configured to protrude into the waveguide; an actuator in operative communication with the adjustable tuning element, wherein the actuator is operable to selectively vary a length of the core that is protruding into the waveguide so as to minimize reflected microwave power in the plasma asher; and a controller in operative communication with the actuator, wherein the controller is configured to selectively activate the actuator upon a change in the plurality of operating conditions.

Claims (33)

1. A variable microwave circuit capable of being tuned to operate under a plurality of operating conditions in a plasma ashing apparatus, comprising:

a waveguide comprising an adjustable tuning element having a core configured to protrude into the waveguide,

wherein the adjustable tuning element comprises a plurality of bearings arranged between the core and the waveguide, and wherein a portion of the core external to the waveguide is grounded, via electrical contact with the plurality of bearings such that microwave leakage between the waveguide and the core is grounded;

an actuator to selectively vary a length of the core of the adjustable tuning element that is protruding into the waveguide; and

a controller configured to selectively adjust the actuator upon a change in the plurality of operating conditions in the plasma ashing apparatus.

2. The microwave circuit of claim 1 , wherein the actuator is pneumatic or electrical.

3. The microwave circuit of claim 1 , wherein the plurality of operating conditions comprises discrete gas compositions, different gas pressures, different microwave power inputs, or a combination comprising at least one of the foregoing.

4. The microwave circuit of claim 3 , wherein the discrete gas compositions comprise nitrogen containing gases, fluorine bearing gases, reducing gases, oxidizing gases, inert gases, or a combination comprising at least one of the foregoing.

5. The microwave circuit of claim 1 , further comprising a vertical positioning system for selectively varying a position of the adjustable tuning element along a length of the waveguide.

6. The microwave circuit of claim 5 , wherein the vertical positioning system comprises:

a vertical actuator to selectively position the adjustable tuning element along the length of the waveguide; and

a controller configured to selectively activate the vertical actuator upon a change in the plurality of operating conditions.

7. A plasma ashing apparatus including the microwave circuit of claim 1 .

8. The variable microwave circuit of claim 1 , wherein the circuit is disposed within a microwave downstream plasma ashing apparatus.

9. A tunable plasma ashing apparatus for stripping photoresist, polymers, and/or residues from a substrate, comprising:

a plasma generating component configured to generate plasma and comprising a microwave power source;

a variable microwave circuit capable of being tuned to operate under a plurality of operating conditions, wherein the variable microwave circuit comprises:

a waveguide in operative communication with the microwave power source configured to transmit microwave energy therethrough;

an adjustable tuning element comprising a core configured to protrude into the waveguide,

wherein the core comprises a plurality of bearings arranged between the core and the waveguide,

wherein the bearings comprise metal or metal alloy, and

wherein the plurality of bearings are disposed outside of the waveguide;

an actuator to selectively vary a length of the core of the adjustable tuning element that is protruding into the waveguide;

a controller configured to selectively adjust the actuator upon a change in the plurality of operating conditions; and

a process chamber for housing the substrate in fluid communication with the plasma generating component.

10. The tunable plasma ashing apparatus of claim 9 , wherein a selected one or both of the plurality of bearings and the core comprise beryllium copper.

11. The tunable plasma ashing apparatus of claim 9 , wherein the actuator is pneumatic or electrical.

12. The tunable plasma ashing apparatus of claim 9 , wherein the plurality of operating conditions comprises different total gas flows, discrete gas compositions, different gas pressures, different microwave power inputs, or a combination comprising at least one of the foregoing.

13. The tunable plasma ashing apparatus of claim 12 , wherein the discrete gas compositions comprise nitrogen containing gases, fluorine bearing gases, reducing gases, oxidizing gases, inert gases, or a combination comprising at least one of the foregoing.

14. The tunable plasma ashing apparatus of claim 9 , further comprising a vertical positioning system configured to selectively vary a position of the adjustable tuning element along a length of the waveguide.

15. The tunable plasma ashing apparatus of claim 14 , wherein the vertical positioning system comprises:

a vertical actuator to selectively position the adjustable tuning element along the length of the waveguide; and

a controller configured to selectively activate the vertical actuator upon a change in the plurality of operating conditions.

Assignments (5)
TERMINATION OF SECURITY AGREEMENT Recorded Apr 16, 2013
From: SILICON VALLEY BANK
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 030302/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2012
From: AXCELIS TECHNOLOGIES, INC.
To: LAM RESEARCH CORPORATION
Reel/Frame 029529/0757 →
FIRST AMENDMENT TO SECURITY AGREEMENT Recorded May 10, 2011
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 026250/0524 →
SECURITY AGREEMENT Recorded Apr 8, 2010
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 024202/0494 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2010
From: SRIVASTAVA, ASEEM K.; COUILLIARD, ROBERT P.
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 023732/0754 →
Continuity (1)
Related Publication 20110114115A1 · May 19, 2011