Silicon-rich low thermal budget silicon nitride for integrated circuits
View Patent ↗A low-thermal budget, silicon-rich silicon nitride film may include a concentration of hydrogen in Si—H bonds being at least 1.5 times as great as a concentration of hydrogen in N—H bonds. The silicon nitride film suppresses boron diffusion in boron-doped devices when such devices are processed using high-temperature processing operations that conventionally urge boron diffusion. The low-thermal budget, silicon-rich silicon nitride film may be used to form spacers in CMOS devices, it may be used as part of a dielectric stack to prevent shorting in tightly packed SRAM arrays, and it may be used in BiCMOS processing to form a base nitride layer and/or nitride spacers isolating the base from the emitter. Furthermore the low-thermal budget, silicon-rich silicon nitride film may remain covering the CMOS structure while bipolar devices are being formed, as it suppresses the boron diffusion that results in boron penetration and boron-doped poly depletion.
1. A semiconductor product comprising at least one semiconductor MOS transistor having a gate structure including a polysilicon gate and at least one silicon nitride spacer formed adjacent said gate structure, said silicon nitride spacer formed of SiN material characterized by having a Si—H concentration of silicon-hydrogen bonds being at least 1.5 times as great as a N—H concentration of nitrogen-hydrogen bonds, said polysilicon gate including boron as a dopant impurity.
2. The semiconductor product as in claim 1 , in which said polysilicon gate includes a boron dopant impurity concentration being at least 1e 19 atoms/cm 3 .
3. The semiconductor product as in claim 1 , in which said Si—H concentration lies within the range of 1e 20 -5e 20 atoms/cm 3 and said N—H concentration lies within the range of 5e 19 -8e 19 atoms/cm 3 .
4. A transistor comprising a boron doped active region and an SiN spacer isolating said boron doped active region from other regions of the transistor, said SiN spacer characterized by having a Si—H concentration of silicon-hydrogen bonds being at least 1.5 times as great as a N—H concentration of nitrogen-hydrogen bonds therein.
5. The semiconductor product as in claim 4 , in which said transistor comprising a bipolar transistor having a base an an emitter and wherein said base is formed of a boron-doped polysilicon section and an SiGe section, and said emitter is formed of polysilicon material.
6. The semiconductor product as in claim 4 , in which said boron doped region comprises a base of a bipolar transistor, said base including a boron-doped polysilicon film having an opening therein, said opening including sidewalls, said at least one silicon nitride spacer formed along said sidewalls, and said transistor having an emitter formed of a semiconductor material extending within said opening and isolated from said base by at least said at least one silicon nitride spacer.
7. The semiconductor product as in claim 4 , in which said transistor is a bipolar transistor having a base and an emitter and wherein said emitter is formed of a polysilicon material including a section overlapping said base, said base formed of boron-doped polysilicon, and said SiN material comprises a silicon nitride film vertically interposed between said section of said emitter and said base.
8. The semiconductor product as in claim 4 , in which said SiN material includes said Si—H concentration within the range of 1e 20 -5e 20 atoms/cm 3 and said N—H concentration within the range of 5e 19 -8e 19 atom/cm 3 .
9. The semiconductor product as in claim 4 , in which said bipolar transistor is formed on a substrate as part of an integrated circuit and further comprising at least one MOS transistor formed on said substrate in said integrated circuit, said SiN material forming a film that extends over said at least one MOS transistor.