Granted Patent B2

US 7,018,747 · App. 10/261,905 · Granted Mar 28, 2006

Abstract

Claims (36)

1. A photomask for forming an integrated circuit, comprising:

a light transmissive substrate;

an opaque feature covering a portion of the substrate, wherein the opaque feature has a length and a width wherein the length is greater than the width and wherein the opaque feature corresponds to a feature of the integrated circuit having a length and a width and further wherein the opaque feature length is less than the length of the corresponding integrated circuit feature; and

a depression formed in a portion of the substrate not covered by the feature, but in proximity to an edge of the feature.

2. The photomask of claim 1 , further wherein a depth of the depression produces a phase difference between light passing through the substrate outside the depression and light passing through the depression of 180°.

3. The photomask of claim 1 , wherein the depression defines a mesa structure in the substrate wherein the mesa structure underlies the opaque feature and wherein a width of the mesa structure is substantially equal to a width of the opaque feature.

4. The photomask of claim 3 , wherein an length of the opaque feature is the length of the mesa.

5. The photomask of claim 1 , wherein the opaque feature comprises a chromium-based material and the substrate comprises quartz.

6. The photomask of claim 1 , wherein the depression is positioned at an end of the opaque feature and wherein a width of the depression is substantially equal to a width of the opaque feature.

7. A method for forming a photomask, comprising:

forming an opaque feature having a length and a width on a light transmissive substrate wherein the opaque feature corresponds to a feature of an integrated circuit to be formed using the photomask, and further wherein the length of the opaque feature is less than a length of the corresponding integrated circuit element; and

etching a depression in at least a portion of the substrate not covered by the opaque feature, but in proximity to an edge of the opaque feature.

8. The method of claim 7 , wherein forming the opaque feature comprises:

depositing an opaque material across the substrate;

patterning a first photoresist layer on the opaque material such that an area of the opaque material is exposed;

etching the area of the opaque material exposed by the first photoresist layer to define the feature;

removing the first photoresist layer;

patterning a second photoresist layer on the feature such that an end of the feature is exposed; and

etching the exposed end of the feature, thereby shortening a length of the feature and exposing an area of the substrate.

9. The method of claim 8 , wherein etching the depression in the substrate comprises etching the area of the substrate exposed by the etching of the end of the feature, thereby forming the depression in the substrate directly adjacent to an edge of the feature.

10. The method of claim 7 , wherein etching the depression comprises etching the entire portion of the substrate not covered by the opaque feature.

11. The method of claim 10 , wherein the feature is used as a mask during the etching of the depression in the substrate such that the depression is self-aligned to an edge of the feature.

12. The method of claim 11 , further comprising:

patterning a second photoresist layer on the feature subsequent to the etching of the depression in the substrate, thereby exposing an end of the feature; and

etching the end of the feature exposed by the second photoresist layer such that the depression is laterally spaced from the edge of the patterned feature.

13. The method of claim 7 , wherein the feature comprises a chromium-based material and the substrate comprises quartz.

14. The method of claim 7 , wherein the depression wherein the depression is positioned at an end of the opaque feature and wherein a width of the depression is substantially equal to a width of the opaque feature.

15. A photomask for fabricating an integrated circuit, comprising:

a light transmissive substrate comprising a thick portion having a first thickness and a thinner portion having a second thickness; and

an opaque feature formed on a portion of the thick portion of the substrate, an edge of the opaque feature being in proximity to the thinner portion of the substrate, wherein the opaque feature defines a line corresponding to a line in the integrated circuit and

wherein a length of the opaque feature is shorter than a length of the corresponding integrated circuit line.

16. The photomask of claim 15 , wherein the edge of the opaque feature is directly adjacent to the thin portion of the substrate.

17. The photomask of claim 15 , wherein the edge of the opaque feature is laterally displaced from the thin portion wherein a portion of the thick portion of the substrate at an end of the opaque feature is not covered by the opaque feature.

18. The photomask of claim 15 , wherein the thick portion of the substrate comprises the majority of the substrate and the thin portion of the substrate comprises portions of the substrate in proximity to an end of an opaque feature.

19. The photomask of claim 15 , wherein the thin portion of the substrate comprises substantially all portions of the substrate not covered by the opaque feature.

20. The phototnaak of claim 15 , wherein the thickness difference between the thin portion and the thick portion is approximately equal to (λ/2)/(n−1) where λ is the wavelength of light to which the photomask is exposed and n is the refractive index of the substrate.

Assignments (22)