Process for etching a metal layer system
View Patent ↗The present invention relates to a process for etching a metal layer system. The metal layer system includes a first aluminum-containing layer, a second aluminum-containing layer, and an interlayer arranged between the two aluminum-containing layers. The interlayer consists of a material that is suitable for end-point detection. The etching process includes a first etching step, in which the upper aluminum-containing layer is etched using a first etching angle, and a second etching step, in which the lower aluminum-containing layer is etched using a second etching angle. The process switches between the first etching step and the second etching step as soon as the end-point detection has detected that the interlayer has been reached. Accordingly, the interlayer is arranged at a location at which it is intended for the process to switch from the first etching step to the second etching step.
1. A process for etching a metal layer system, the process which comprises:
providing a semiconductor wafer including at least an upper aluminum-containing layer, a lower aluminum-containing layer configured below the upper aluminum-containing layer, and an interlayer separating the upper aluminum-containing layer from the lower aluminum-containing layer;
performing a first etching step for etching the upper aluminum-containing layer using a first etching angle;
performing a second etching step for etching the lower aluminum-containing layer using a second etching angle being different than the first etching angle; and
switching from the first etching step to the second etching step as soon as an end-point detection has detected that the interlayer has been reached.
2. The process according to claim 1 , which comprises:
while performing the first etching step and the second etching step, etching a trench;
while performing the first etching step, producing substantially vertical walls of the trench; and
while performing the second etching step, producing inclined walls of the trench to reduce a diameter of the trench.
3. The process according to claim 1 , which comprises: performing the first etching step with a higher etching rate than when performing the second etching step.
4. The process according to claim 1 , which comprises:
while performing the first etching step and the second etching step, using an etching gas including a mixture of BCl 3 and Cl 2 ;
while performing the first etching step, using a first proportion of the BCl 3 and a second proportion of the Cl 2; and
while performing the second etching step, using a proportion of the BCl 3 that is higher than the first proportion and using a proportion of the Cl 2 that is lower than the second proportion.
5. The process according to claim 4 , wherein: the etching gas also includes CH 4 and N 2 .
6. The process according to claim 1 , which comprises: providing the interlayer with a thickness of 5 to 20 nm; and providing the interlayer with a metal other than aluminum.
7. The process according to claim 1 , wherein: the interlayer at least includes a titanium-containing layer.
8. The process as claimed in claim 7 , wherein: the titanium-containing layer includes a layer selected from a group consisting of a titanium layer and a TiN layer.