IP Library Granted Patent US 6,917,214
Granted Patent B2
US 6,917,214 · App. 10/278,227 · Granted Jul 12, 2005

Method for testing a plurality of devices disposed on a wafer and connected by a common data line

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Quick Facts
Patent No.
US 6,917,214
App. No.
10/278,227
Granted
Jul 12, 2005
Kind
B2
Abstract

In a method for testing a plurality of devices, which are arranged on a wafer and connected to a common data line, wherein the devices are connectable to a test unit via the common data line, a connection is separated first between a defective device and the common data line, or an internal connection in the defective device is separated. Subsequently, the remaining devices are tested. Alternatively, instead of the connection between the defective device and the common data line, the connection between a defective device and a common or an individual supply line is separated.

Claims (10)

1. A method for testing a plurality of devices, the devices being arranged on a wafer, connected to a common data line, and connected to a common supply line for applying a supply power, wherein the devices, via the common data line, are connectable to a test unit, the method comprising:

(a) determining defective devices on the wafer;

(b) separating a connection between defective device and the common data line;

(c) applying to all of the devices the supply power distribution across the wafer during subsequent testing via the common supply line for achieving a regular temperature distribution; and

(d) testing the remaining, non-defective devices.

2. The method in accordance with claim 1 , wherein the plurality of devices are connected to a supply line, wherein the step (a) further includes separating of a connection between a defective device and the supply line.

3. The method in accordance with claim 2 , wherein each of the devices on the wafer comprises a supply line or wherein several of the devices comprise a common supply line.

4. The method in accordance with claim 1 , wherein, in step (a), an input and/or an output of the defective devices is separated.

5. The method in accordance with claim 1 , wherein the separating process is carried out by using laser energy.

6. The method in accordance with claim 1 , wherein the step (d) includes applying a test signal to the common data line, receiving a response signal from the devices, and assessing the response signal.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036808/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2005
From: FARBER, GERRIT; FRITZ, MARTIN; MOCKEL, JENS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016601/0869 →