Block level routing architecture in a field programmable gate array
View Patent ↗An FPGA architecture has top, middle and low levels. The top level of the architecture is an array of the B16×16 tiles arranged in a rectangular array and enclosed by I/O blocks on the periphery. On each of the four sides of a B16×16 tile, and also associated with each of the I/O blocks is a freeway routing channel. A B16×16 tile in the middle level of hierarchy is a sixteen by sixteen array of B 1 blocks. The routing resources in the middle level of hierarchy are expressway routing channels M 1 , M 2 , and M 3 including groups of interconnect conductors. At the lowest level of the semi-hierarchical FPGA architecture, there are block connect (BC) routing channels, local mesh (LM) routing channels, and direct connect (DC) interconnect conductors. Each BC routing channel is coupled to an expressway tab to provide access for each B 1 block to the expressway routing channels M 1 , M 2 , and M 3 , respectively. Each BC routing channel has nine interconnect conductors which are grouped into three groups of three interconnect conductors. Each group of three interconnect conductors is connected to a first side of a Extension Block (EB) 3×3 switch matrix. A second side of each EB 3×3 switch matrix is coupled to the E-tab. Between adjacent B 1 blocks, in both the horizontal and vertical directions, the leads on the second side of a first EB 3×3 switch matrix may be coupled to the leads on the second side of second EB3×3 switch matrix by BC criss-cross extension.
1. An extension for coupling a first level of interconnect conductors to an expressway level of interconnect conductors comprising:
a first logic module having n inputs and m outputs;
a first switching matrix having n inputs and m outputs, said n inputs of said switching matrix coupled to said n inputs and m outputs of said logic module and a matrix of switches coupled between said n inputs and m outputs of said first logic module and said first switching matrix;
a second logic module having n inputs and m outputs;
a second switching matrix having n inputs and m outputs, said n inputs of said switching matrix coupled to said n inputs and m outputs of said second logic module and a matrix of switches coupled between said n inputs and m outputs of said second logic module and said second switching matrix;
said m outputs of first switching matrix having a plurality of output lines and said m outputs of said second switching matrix having a plurality of output lines, said output lines of said first switching matrix running parallel to said output lines of said second switching matrix in a crossover region; and
a set of expressway conductors crossing through said crossover region, said expressway conductors forming intersections with said output lines of said first and second switching matrices; and
programmable interconnects disposed at said intersections.
2. The extension according to claim 1 wherein said n inputs and m outputs of said logic modules are coupled to said n inputs of said switching matrices through buffers.
3. The extension according to claim 1 wherein said n inputs and m outputs of said logic modules are coupled to said n inputs of said switching matrices through bi-directional tri-state buffers.
4. The extension according to claim 1 further comprising:
a plurality of switching matrices, wherein said plurality of switching matrices includes said second switching matrix; and
wherein said first switching matrix is coupled to each switching matrix in said plurality of switching matrices.
5. A method of coupling a first level of interconnect conductors with a second level of interconnect conductors comprising:
providing a first logic module having n inputs and m outputs;
providing a first switching matrix having n inputs and m outputs, said n inputs of said switching matrix coupled to said n inputs and m outputs of said logic module and a matrix of switches coupled between said n inputs and m outputs of said first logic module and said first switching matrix;
providing a second logic module having n inputs and m outputs;
providing a second switching matrix having n inputs and m outputs, said n inputs of said switching matrix coupled to said n inputs and m outputs of said logic module and a matrix of switches coupled between said n inputs and m outputs of said second logic module and said second switching matrix;
providing said m outputs of first switching matrix having a plurality of output lines and said m outputs of said second switching matrix having a plurality of output lines, said output lines of said first switching matrix running parallel to said output lines of said second switching matrix in a crossover region; and
providing a set of expressway conductors crossing through said crossover region, said expressway conductors forming intersections with said output lines of said first and second switching matrices; and
depositing programmable interconnects at said intersections.
6. A method of coupling a first level of interconnect conductors with a second level of interconnect conductors according to claim 5 wherein said n inputs and m outputs of said logic modules are coupled to said n inputs of said switching matrices through buffers.
7. A method of coupling a first level of interconnect conductors with a second level of interconnect conductors according to claim 5 wherein said n inputs and m outputs of said logic modules are coupled to said n inputs of said switching matrices through bi-directional tri-state buffers.
8. The method of claim 5 , wherein said second switching matrix is included in a plurality of switching matrices, further comprising:
coupling said first switching matrix to each switching matrix in said plurality of switching matrices.