Method and apparatus for finding a fault in a signal path on a printed circuit board
View Patent ↗In the case of the present-day trend of miniaturizing housed electronic devices, there is the problem that the contact spacings between the terminal pins becomes smaller and smaller and are no longer visible optically. As a result, it also becomes more difficult to solder the contacts of correspondingly designed contact bases, which for example, are designed as test bases, to the individual conductor tracks of the printed circuit board. Possible faulty soldering points, short circuits or interruptions have hitherto been tracked down by laborious manual measurement using the TDR method. The invention proposes producing a test device in which in each case two terminal pins are connected to a short-circuiting bridge. The test device is inserted into the contact base and connects two signal paths of the printed circuit board on which the propagation time of a reflected wave can be measured.
1. A method for finding a fault in a first signal path on a printed circuit board, the method which comprises:
applying an electronic device on the printed circuit board, the electronic device functioning as a test device having at least two terminal pins;
connecting the two terminal pins to one another with a short-circuiting bridge for lengthening the first signal path being tested; and
testing the first signal path by using a Time Domain Reflectometry method taking account of a propagation time of a reflected wave to thereby determine a faulty location situated in the first signal path.
2. The method according to claim 1 , wherein: the two terminal pins connect the first signal path to a second signal path on the printed circuit board.
3. The method according to claim 2 , which comprises using a switch to sever the first signal path or the second signal path.
4. The method according to claim 2 , which comprises testing the first signal path and the second signal path by using a measuring and control device to sequentially switch the first signal path and the second signal path on or off.
5. The method according to claim 4 , which comprises controlling the step of testing the first signal path and the second signal path by using a software program that switches the first, signal path and the second signal path.
6. The method according to claim 5 , wherein the step of testing the first signal path and the second signal path is performed automatically.
7. The method according to claim 4 , wherein the step of testing the first signal path and the second signal path is performed automatically.
8. The method according to claim 1 , which comprises:
applying at least one contact base for the electronic device on the printed circuit board; and
testing the quality of a soldering point at a contact of the contact base.
9. The method according to claim 1 , which comprises:
providing the printed circuit board as a multilayer printed circuit board having a plated-through hole; and
testing the plated-through hole.
10. The method according to claim 1 , which comprises:
using the two terminal pins to connect the first signal path to a second signal path on the printed circuit board; and
testing the first signal path and the second signal path with regard to a fault selected from a group consisting of an interruption and a short circuit.