IP Library Granted Patent US 6,712,676
Granted Patent Utility
US 6,712,676 · Confirmation No. 7671

METHODS AND APPARATUSES FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES ON PLANARIZING PADS

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Code Description Pages PDF
2005-01-26 COCOUT Certificate of Correction - Post Issue Communication 1 View
2004-02-17 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-11-19 TRNA Transmittal of New Application 3 View
2002-11-19 ADS Application Data Sheet 2 View
2002-11-19 A.PE Preliminary Amendment 2 View
2002-11-19 SPEC Specification 17 View
2002-11-19 CLM Claims 19 View
2002-11-19 ABST Abstract 1 View
2002-11-19 DRW Drawings-only black and white line drawings 7 View
2002-11-19 OATH Oath or Declaration filed 12 View
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Quick Facts
Patent No.
US 6,712,676
App. No.
10/300,344
Filed
2002-11-19
Granted
2004-03-30
Pub. No.
US20030073390A1
Art Unit
3725
PTA
-105 days