IP Library Granted Patent US 6,638,148
Granted Patent Utility
US 6,638,148 · Confirmation No. 8639

METHODS AND APPARATUSES FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES ON PLANARIZING PADS

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Code Description Pages PDF
2003-09-28 LET. Miscellaneous Incoming Letter 1 View
2003-09-28 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2003-08-19 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-19 IDS Information Disclosure Statement (IDS) Form (SB08) 8 View
2003-08-19 LET. Miscellaneous Incoming Letter 6 View
2003-07-28 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2001-05-11 TRNA Transmittal of New Application 3 View
2001-05-11 ADS Application Data Sheet 2 View
2001-05-11 A.PE Preliminary Amendment 2 View
2001-05-11 SPEC Specification 17 View
2001-05-11 CLM Claims 19 View
2001-05-11 ABST Abstract 1 View
2001-05-11 DRW Drawings-only black and white line drawings 7 View
2001-05-11 OATH Oath or Declaration filed 12 View
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Quick Facts
Patent No.
US 6,638,148
App. No.
09/854,390
Filed
2001-05-11
Granted
2003-10-28
Pub. No.
US20010031550A1
Art Unit
3725
PTA
-77 days