IP Library Granted Patent US 7,132,873
Granted Patent B2
US 7,132,873 · App. 10/338,551 · Granted Nov 7, 2006

Method and apparatus for avoiding gated diode breakdown in transistor circuits

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Quick Facts
Patent No.
US 7,132,873
App. No.
10/338,551
Granted
Nov 7, 2006
Kind
B2
Abstract

An N-channel transistor protection circuit and method are disclosed that prevent gated diode breakdown in N-channel transistors that have a high voltage on their drain. The disclosed N-channel protection circuit may be switched in a high voltage mode between a high voltage level and a lower rail voltage. A high voltage conversion circuit prevents gated diode breakdown in N-channel transistors by dividing the high voltage across two N-channel transistors, MXU 0 and MXU 1 , such that no transistor exceeds the breakdown voltage, V breakdown . An intermediate voltage drives the top N-channel transistor, MXU 0 . The top N-channel transistor, MXU 0 , is gated with a voltage level that is at least one N-channel threshold, V tn , below the high voltage level, V ep , using the intermediate voltage level, nprot. The drain voltage of MXU 0 will be at least one N-channel threshold, V tn , lower than the input voltage level, nprot, and the drain voltage V d of the bottom N-channel transistor, MXU 1 , is limited to less than the breakdown voltage, V breakdown .

Claims (25)

1. A method for avoiding gated diode breakdown in a voltage conversion circuit having at least two N-channel output driver transistors in series, said voltage conversion circuit capable of switching between a high voltage level and a lower rail voltage in a high voltage mode, said method comprising the steps of:

providing a logic input value to select between said high voltage level and said lower rail voltage;

gating one of said at least two N-channel output driver transistors in said high voltage mode with an intermediate voltage level that is between one transistor threshold above said lower rail voltage and one transistor threshold above a breakdown voltage of said at least two N-channel output driver transistors, wherein said intermediate voltage level is generated in said high voltage mode by dropping said high voltage level across at least one N-channel transistor; and

preventing a snapback condition when generating said intermediate voltage level.

2. The method of claim 1 , wherein said intermediate voltage level is at least one transistor threshold level below said high voltage level in said high voltage mode.

3. The method of claim 1 , wherein said intermediate voltage level is at least one transistor threshold level above said lower rail voltage in a high voltage mode.

4. The method of claim 1 , further comprising the step of applying an input signal to a source of a second one of said at least two N-channel output driver transistors.

5. The method of claim 4 , wherein said input signal is normally ground.

6. The method of claim 5 , wherein said input signal is switched to said lower rail voltage.

7. The method of claim 1 , further comprising the step of discharging said intermediate voltage level following said high voltage mode.

8. The method of claim 1 , further comprising the step of employing a plurality of stacked transistors to pull a small current from said intermediate voltage level to ensure that said at least one N-channel transistor remains in an ON condition.

9. The method of claim 8 , wherein said small current is generated by a current source.

10. The method of claim 1 , wherein said lower rail voltage is equal to a positive voltage level or ground.

11. A voltage conversion circuit capable of switching between a high voltage level and a lower rail voltage in a high voltage mode, comprising:

at least two N-channel output driver transistors in series;

a logic input circuit that selects between said high voltage level and said lower rail voltage;

at least one of said at least two N-channel output driver transistors is gated by an intermediate voltage level between one transistor threshold above said lower rail voltage and one transistor threshold above a breakdown voltage of said at least two N-channel output driver transistors, wherein said intermediate voltage level is generated in said high voltage mode by dropping said high voltage level across at least one N-channel transistor; and

means for preventing a snapback condition when generating said intermediate voltage level.

12. The voltage conversion circuit of claim 11 , wherein said intermediate voltage level is at least one transistor threshold level below said high voltage level in said high voltage mode.

13. The voltage conversion circuit of claim 11 , wherein said intermediate voltage level is at least one transistor threshold level above said lower rail voltage in a high voltage mode.

14. The voltage conversion circuit of claim 11 , wherein an input signal is applied to a source of a second one of said at least two N-channel output driver transistors.

15. The voltage conversion circuit of claim 14 , wherein said input signal is ground.

16. The voltage conversion circuit of claim 15 , wherein said input signal is switched to said lower rail voltage.

17. The voltage conversion circuit of claim 11 , wherein said lower rail voltage is equal to a positive voltage level or ground.

18. The voltage conversion circuit of claim 11 , further comprising a plurality of stacked transistors to pull a small current from said intermediate voltage level to ensure that said at least one N-channel transistor remains in an ON condition.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2004
From: ADVANCED TECHNOLOGY MATERIALS, INC.
To: EMOSYN AMERICA, INC.
Reel/Frame 015503/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2003
From: HOLLMER, SHANE C.
To: ADVANCED TECHNOLOGY MATERIALS, INC.
Reel/Frame 014013/0723 →