IP Library Granted Patent US 6,879,476
Granted Patent B2
US 6,879,476 · App. 10/348,814 · Granted Apr 12, 2005

Electrostatic discharge circuit and method therefor

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Quick Facts
Patent No.
US 6,879,476
App. No.
10/348,814
Granted
Apr 12, 2005
Kind
B2
Abstract

An ESD protection circuit ( 81 ) and a method for providing ESD protection is provided. In some embodiments, an N-channel transistor ( 24 ), which can be ESD damaged, is selectively turned on and made conducting. The purpose of turning on the N-channel transistor ( 24 ) is to maximize the Vt 1 of the N-channel transistor ( 24 ). Vt 1 is the drain-to-source voltage point at which the parasitic bipolar action of the N-channel transistor ( 24 ) first occurs. In some embodiments, the ESD protection circuit ( 81 ) includes a diode ( 64 ) which provides an additional current path from the I/O pad 31 to a first power supply node ( 76 ).

Claims (46)

1. An output circuit having ESD protection, comprising:

an output terminal;

a transistor to be protected from ESD, the transistor having a first current electrode, a second current electrode coupled to a first voltage supply, and a control electrode;

a first resistive element having a first terminal coupled to the output terminal and a second terminal coupled to the first current electrode of the transistor; and

a biasing circuit coupled to the control electrode of the transistor, wherein, during at least ten percent of a duration of an ESD event, the biasing circuit applies a voltage to the control electrode of the transistor that is approximately equal to a voltage at a circuit node located between the first current electrode of the transistor and the output terminal.

2. The circuit of claim 1 , wherein the biasing circuit applies the voltage to the control electrode of the transistor during at least fifty percent of the duration of the ESD event.

3. The circuit of claim 1 , wherein the circuit node is located at one of the first or the second terminals of the first resistive element.

4. The circuit of claim 1 , wherein the circuit node is located at the first current electrode of the transistor.

5. The circuit of claim 1 , wherein during the ESD event, the biasing circuit couples the circuit node to the control electrode of the transistor.

6. The circuit of claim 5 , wherein the circuit node is located at the first current electrode of the transistor and the biasing circuit further comprises:

an ESD event detection circuit coupled to the output terminal for detecting the ESD event; and

a switching circuit coupled to the ESD event detection circuit, the first current electrode of the transistor, and the control electrode of the transistor, wherein the switching circuit couples the first current electrode of the transistor to the control electrode of the transistor in response to the ESD event detection circuit detecting the ESD event.

7. The circuit of claim 1 , wherein the transistor comprises an NMOS transistor.

8. The circuit of claim 1 , further comprising a second resistive element coupled between the transistor and the first voltage supply, the second resistive element having a first terminal coupled to the second current electrode of the transistor and a second terminal coupled to the first voltage supply.

9. The circuit of claim 1 , further comprising a diode having a first terminal coupled to the circuit node, and a second terminal coupled to a second voltage supply.

10. An output circuit having ESD protection, comprising:

an output terminal;

a transistor to be protected from ESD, the transistor having a first current electrode, a second current electrode, and a control electrode;

a first resistive element having a first terminal coupled to the second current electrode of the transistor and a second terminal coupled to a first voltage supply; and

a biasing circuit coupled to the control electrode of the transistor, wherein, during at least ten percent of a duration of an ESD event, the biasing circuit applies a voltage to the control electrode of the transistor that is approximately equal to a voltage at a circuit node located between the first current electrode of the transistor and the output terminal.

11. The circuit of claim 10 , wherein the biasing circuit applies the voltage to the control electrode of the transistor during at least fifty percent of the duration of the ESD event.

12. The circuit of claim 10 , wherein the circuit node is located at the first current electrode of the transistor.

13. The circuit of claim 10 , wherein during the ESD event, the biasing circuit couples the circuit node to the control electrode of the transistor.

14. The circuit of claim 13 , wherein the circuit node is located at the first current electrode of the transistor and the biasing circuit further comprises:

an ESD event detection circuit coupled to the output terminal for detecting the ESD event; and

a switching circuit coupled to the ESD event detection circuit, the first current electrode of the transistor, and the control electrode of the transistor, wherein the switching circuit couples the first current electrode of the transistor to the control electrode of the transistor in response to the ESD event detection circuit detecting the ESD event.

15. The circuit of claim 10 , wherein the transistor comprises an NMOS transistor.

16. The circuit of claim 10 , further comprising a second resistive element coupled between the first current electrode of the transistor and the output terminal.

17. A method for providing ESD protection for an NMOS transistor having a first current electrode coupled via a resistive element to an output terminal, a second current electrode, and a control electrode, comprising:

detecting an occurrence of an ESD event; and

in response to detecting the occurrence of the ESD event, applying a voltage to the control electrode of the NMOS transistor that substantially tracks a voltage at a circuit node located between the NMOS transistor and the output terminal during at least ten percent of a duration of the ESD event, and wherein, during the at least ten percent of the duration, the NMOS transistor provides a current path through the resistive element.

18. The method of claim 17 , wherein applying further comprises coupling the control electrode of the NMOS transistor to the circuit node.

19. The method of claim 17 further comprising applying a current through the resistive element during the ESD event to increase a voltage at the output terminal.

20. A method for providing ESD protection for an NMOS transistor having a first current electrode coupled to an output terminal, a second current electrode coupled via a resistive element to a supply voltage, and a control electrode, comprising:

detecting an occurrence of an ESD event; and

in response to detecting the occurrence of the ESD event, applying a voltage to the control electrode of the NMOS transistor that substantially tracks a voltage at a circuit node located between the NMOS transistor and the output terminal during at least ten percent of a duration of the ESD event and wherein, during the at least ten percent of the duration, the NMOS transistor provides a current path through the resistive element.

21. The method of claim 20 , wherein applying further comprises coupling the control electrode of the NMOS transistor to the circuit node.

22. The method of claim 20 further comprising applying a current through the resistive element during the ESD event to increase a voltage at the output terminal and inhibit a bipolar transistor of the NMOS transistor from turning on.

23. An output circuit having ESD protection, comprising:

an output terminal;

a resistive element having a first terminal coupled to the output terminal and a second terminal; and

a transistor to be protected from ESD, the transistor having a first current electrode coupled to the second terminal of the first resistive element, a second current electrode coupled to a first voltage supply, and a control electrode, wherein, during at least fifty percent of a duration of an ESD event, the transistor provides a current path from the output terminal through the resistive element.

24. An output circuit having ESD protection, comprising:

an output terminal;

a resistive element having a first terminal coupled to a first voltage supply and a second terminal; and

a transistor to be protected from ESD, the transistor having a first current electrode coupled to the output terminal, a second current electrode coupled to the second terminal of the resistive element, and a control electrode, wherein, during at least fifty percent of a duration of an ESD event, the transistor provides a current path from the output terminal through the resistive element.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2003
From: KHAZHINSKY, MICHAEL G.; MILLER, JAMES W.; STOCKINGER, MICHAEL
To: MOTOROLA, INC.
Reel/Frame 013695/0806 →