Granted Patent B2

US 6,854,637 · App. 10/372,061 · Granted Feb 15, 2005

Abstract

Claims (30)

1. A method of electrically connecting a first device to a second device, the method comprising the steps of:

forming a first bond by wirebonding a first portion of an insulated wire to a bond pad of the first device, thereby electrically connecting the bond wire and the first device;

forming a second bond by wirebonding a second portion of the insulated wire to a bond pad of the second device, thereby electrically connecting the first device and the second device; and

forming a bump on the second bond, and bond pad of the second device, wherein the bump is offset from a center of the second bond.

2. The electrical connection method of claim 1 , wherein the bump on the second bond is offset by a distance of about one half of a diameter of the bump.

3. The electrical connection method of claim 1 , wherein the bump has a diameter of about 40 to 50 um.

4. The electrical connection method of claim 1 , wherein the bump is formed of gold.

5. The electrical connection method of claim 1 , wherein the insulated wire comprises one of a gold or copper wire having an organic insulative coating.

6. The electrical connection method of claim 5 , wherein the insulated wire has a diameter of less than or equal to about 25 um.

7. The electrical connection method of claim 6 , wherein the insulative coating has a thickness of about 0.5 um to 2.0 um.

8. The electrical connection method of claim 7 , wherein the insulative coating has a Tg of about 180° to 260° C.

9. The electrical connection method of claim 1 , wherein the first bond comprises a ball bond.

10. The electrical connection method of claim 1 , wherein the second bond comprises a stitch bond.

11. The electrical connection method of claim 1 , wherein the second device comprises a carrier.

12. A method of enhancing the strength of a second wire bond of a coated wire wedge bonded to a lead, the method comprising the steps of:

forming a bump on the second bond and the lead, wherein the bump is offset from a center of the second bond.

13. An electrical connection for connecting a bond pad of a first device and a bond pad of a second device, the electrical connection comprising:

a first wirebond securing a first portion of an insulated bond wire to the first device bond pad;

a second wirebond securing a second portion of the insulated bond wire to the second device bond pad; and

a bump formed over the second wirebond and on the second device bond pad, wherein the bump is offset from the second wirebond.

14. The electrical connection of claim 13 , wherein the bump on the second bond is offset by a distance of about one half of a diameter of the bump.

15. The electrical connection of claim 13 , wherein the bump has a diameter of about 40 to 50 um.

16. The electrical connection of claim 13 , wherein the bump is formed of gold.

17. The electrical connection of claim 13 , wherein the insulated wire comprises one of a gold or copper wire having an organic insulative coating.

18. The electrical connection of claim 17 , wherein the insulated wire has a diameter of less than or equal to about 25 um.

19. The electrical connection of claim 18 , wherein the insulative coating has a thickness of about 0.5 um to 2.0 um.

20. The electrical connection of claim 17 , wherein the insulative coating has a Tg of about 180° to 260° C.

21. The electrical connection of claim 13 , wherein the first bond comprises a ball bond.

22. The electrical connection of claim 13 , wherein the second bond comprises a stitch bond.

23. The electrical connection method of claim 13 , wherein the second device comprises a carrier.

Assignments (22)