Method of patterning photoresist on a wafer using a reflective mask with a multi-layer ARC
View Patent ↗A patterned reflective semiconductor mask ( 10 ) uses a multiple layer ARC ( 24, 26, 28 ) overlying an absorber stack ( 22 ) that overlies a reflective substrate ( 12, 14 ). The absorber stack has more than one layer and an upper layer of the absorber stack has a predetermined metal. The multiple layer ARC overlying the upper layer of the absorber stack has layers of nitrogen, oxygen and nitrogen combined with the predetermined metal of the upper layer of the absorber stack. The oxygen layer in the ARC has less metallic properties than the nitrogen layers therein. In one form, an overlying dielectric layer ( 30 ) is positioned on the multiple layer ARC to increase light interference. The ARC provides wide bandwidth inspection contrast for extreme ultra-violet (EUV) reticles.
1. A method of patterning photoresist on a semiconductor wafer comprising:
providing a semiconductor substrate;
forming a semiconductor mask, the semiconductor mask comprising:
a mask substrate;
a reflecting layer overlying the mask substrate for reflecting light from the semiconductor mask;
an absorber stack selectively formed overlying the reflecting layer, the absorber stack having a plurality of layers, an upper layer of the absorber stack that is opposite the reflecting layer comprises a predetermined metal; and
a multiple layer anti-reflective coating overlying the upper layer of the absorber stack, the multiple layer anti-reflective coating comprising adjoining layers that respectively have nitrogen, oxygen and nitrogen combined with the predetermined metal of the upper layer of the absorber stack;
projecting incident radiation on the semiconductor mask;
reflecting the incident radiation from reflective portions of the reflective mask as reflected radiation; and
illuminating the photoresist on the semiconductor wafer with the reflected radiation.
2. The method of claim 1 further comprising:
providing an overlying dielectric layer comprising a predetermined material in the semiconductor mask, the overlying dielectric layer providing additional destructive interference of light for a wider bandwidth of inspection wavelengths.
3. The method of claim 2 further comprising implementing the predetermined material of the overlying dielectric layer as one of silicon oxygen nitride, silicon nitride or silicon oxide.
4. The method of claim 1 further comprising implementing the predetermined metal as one of tantalum, chromium, tungsten, tantalum silicide, tantalum boride and oxides and nitrides thereof.
5. The method of claim 1 further comprising implementing the multiple layer anti-reflective coating comprising adjoining layers with tantalum silicon nitride, tantalum silicon oxide and tantalum silicon nitride, respectively.
6. The method of claim 1 further comprising implementing the multiple layer anti-reflective coating with a concentration of nitrogen and oxygen that is greater than any nitrogen or oxygen in the predetermined metal of the upper layer of the absorber stack.
7. The method of claim 1 further comprising:
implementing the multiple layer anti-reflective coating with a layer of oxygen within the adjoining layers, the layer of oxygen having less metallic properties than the remaining adjoining layers.
8. The method of claim 1 wherein the semiconductor mask further comprises an inspection contrast of the semiconductor mask is greater than seventy percent (70%) at multiple inspection wavelengths.
9. The method of claim 1 wherein the semiconductor mask further comprises a reflectivity of the multiple layer anti-reflective coating is less than ten percent (10%) at multiple inspection wavelengths.
10. A method of patterning photoresist on a semiconductor wafer comprising:
providing a semiconductor substrate;
forming a reflective semiconductor mask, the reflective semiconductor mask comprising:
a mask substrate;
a reflecting layer overlying the mask substrate for reflecting light from the semiconductor mask;
an absorber stack selectively formed overlying the reflecting layer, the absorber stack having a plurality of layers, an upper layer of the absorber stack that is opposite the reflecting layer comprises tantalum silicide; and
at least three layers of anti-reflective coating overlying the upper layer of the absorber stack, the at least three layers of anti-reflective coating comprising adjoining layers that respectively have nitrogen, oxygen and nitrogen combined with tantalum silicide;
projecting incident radiation on the reflective semiconductor mask;
reflecting the incident radiation from a reflective portion of the reflective semiconductor mask as reflected radiation; and
illuminating the photoresist on the semiconductor wafer with the reflected radiation.
11. The method of claim 10 further comprising:
forming the reflective semiconductor mask further comprises forming an overlying silicon oxy nitride dielectric layer adjacent the at least three layers of anti-reflective coating, the overlying silicon oxy nitride dielectric layer providing additional destructive interference of light for a wider bandwidth of inspection wavelengths.