IP Library Granted Patent US 6,933,546
Granted Patent B2
US 6,933,546 · App. 10/391,040 · Granted Aug 23, 2005

Semiconductor component

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Quick Facts
Patent No.
US 6,933,546
App. No.
10/391,040
Granted
Aug 23, 2005
Kind
B2
Abstract

A semiconductor component comprises a first semiconductor region ( 110, 310 ), a second semiconductor region ( 120, 320 ) above the first semiconductor region, a third semiconductor region ( 130, 330 ) above the second semiconductor region, a fourth semiconductor region ( 140, 340 ) above the third semiconductor region, a fifth semiconductor region ( 150, 350 ) above the second semiconductor region and at least partially contiguous with the fourth semiconductor region, a sixth semiconductor region ( 160, 360 ) above and electrically shorted to the fifth semiconductor region, and an electrically insulating layer ( 180, 380 ) above the fourth semiconductor region and the fifth semiconductor region. A junction ( 145, 345 ) between the fourth semiconductor region and the fifth semiconductor region forms a zener diode junction, which is located only underneath the electrically insulating layer. In one embodiment, a seventh semiconductor region ( 170 ) circumscribes the third, fourth, fifth, and sixth semiconductor regions.

Claims (74)

1. A semiconductor component comprising:

a first semiconductor region having a first conductivity type;

a second semiconductor region having a second conductivity type located above the first semiconductor region;

a third semiconductor region located above the second semiconductor region;

a fourth semiconductor region located above the third semiconductor region and having a conductivity type;

a fifth semiconductor region having a conductivity type different from the conductivity type of the fourth semiconductor region and located above the second semiconductor region and at least partially contiguous with the fourth semiconductor region;

a sixth semiconductor region having the conductivity type of the fifth semiconductor region and located above and electrically shorted to the fifth semiconductor region;

a seventh semiconductor region having the second conductivity type, at least partially contiguous with the second semiconductor region, and circumscribing the third semiconductor region, the fourth semiconductor region, the fifth semiconductor region, and the sixth semiconductor region; and

an electrically insulating layer above the fourth semiconductor region and the fifth semiconductor region,

wherein:

a junction between the fourth semiconductor region and the fifth semiconductor region forms a zener diode junction;

the fifth semiconductor region has a doping level lower than doping levels of the second semiconductor region, the fourth semiconductor region, the sixth semiconductor region, and the seventh semiconductor region;

the third semiconductor region has a doping level lower than the doping level of the fifth semiconductor region; and

the zener diode junction is located only underneath the electrically insulating layer.

2. The semiconductor component of claim 1 wherein:

the zener diode junction has a breakdown voltage of between approximately five and six volts.

3. The semiconductor component of claim 1 wherein:

the sixth semiconductor region is self-aligned to the electrically insulating layer.

4. The semiconductor component of claim 1 wherein:

the fourth semiconductor region is self-aligned to the electrically insulating layer.

5. The semiconductor component of claim 1 wherein:

the fourth semiconductor region has the first conductivity type; and

the fifth semiconductor region and the sixth semiconductor region have the second conductivity type.

6. The semiconductor component of claim 1 wherein:

the fourth semiconductor region has the second conductivity type; and

the fifth semiconductor region and the sixth semiconductor region have the first conductivity type.

7. The semiconductor component of claim 1 wherein:

the fourth semiconductor region has a maximum function depth of less than approximately 0.4 micrometers, and less than a junction depth of the fifth semiconductor region and the seventh semiconductor region.

8. The semiconductor component of claim 7 wherein:

the fourth semiconductor region has a doping concentration between approximately 5×10 19 and 1×10 20 atoms per cubic centimeter.

9. The semiconductor component of claim 1 wherein:

the fifth semiconductor region has a maximum junction depth less than a junction depth of the seventh semiconductor region.

10. The semiconductor component of claim 9 wherein:

the fifth semiconductor region has a doping concentration between approximately 1×10 18 and 5×10 19 atoms per cubic centimeter.

11. The semiconductor component of claim 1 wherein:

the fifth semiconductor region circumscribes the fourth semiconductor region; and

the sixth semiconductor region circumscribes the fourth semiconductor region.

12. The semiconductor component of claim 11 wherein:

the fifth semiconductor region circumscribes a portion of the third semiconductor region.

13. The semiconductor component of claim 1 wherein:

a first portion of the third semiconductor region is located between the fifth semiconductor region and the second semiconductor region; and

a second portion of the third semiconductor region is located between the fourth semiconductor region and the second semiconductor region.

14. The semiconductor component of claim 1 wherein:

the fourth semiconductor region and the fifth semiconductor region form at least a portion of a zener diode; and

the second semiconductor region and the seventh semiconductor region electrically isolate the zener diode from the first semiconductor region.

15. The semiconductor component of claim 1 wherein:

the third semiconductor region, the fourth semiconductor region, the fifth semiconductor region, the sixth semiconductor region, and the seventh semiconductor region are symmetric about a line drawn through a geometric center of the fourth semiconductor region.

16. The semiconductor component of claim 1 wherein:

the zener diode junction is used in the semiconductor component to provide a voltage clamp.

17. A semiconductor component comprising:

a first semiconductor region having a first conductivity type;

a second semiconductor region having a second conductivity type located above the first semiconductor region;

a third semiconductor region located above the second semiconductor region;

a fourth semiconductor region having the first conductivity type located above the third semiconductor region;

a fifth semiconductor region having the second conductivity type located above the second semiconductor region, circumscribing the third semiconductor region and the fourth semiconductor region, and at least partially contiguous with the fourth semiconductor region and the second semiconductor region;

a sixth semiconductor region having the second conductivity type and electrically coupled to the fifth semiconductor region; and

an electrically insulating layer above the fourth semiconductor region and the fifth semiconductor region,

wherein:

a junction between the fourth semiconductor region and the fifth semiconductor region forms a zener diode junction;

the fifth semiconductor region has a doping level lower than a doping level of the fourth semiconductor region;

the third semiconductor region has a doping level lower than doping levels of the second semiconductor region, the fourth semiconductor region, the fifth semiconductor region, and the sixth semiconductor region; and

the zener diode junction is located only underneath the electrically insulating layer.

18. The semiconductor component of claim 17 wherein:

the zener diode junction has a breakdown voltage of between approximately five and six volts.

19. The semiconductor component of claim 17 wherein:

the fourth semiconductor region has a maximum junction depth of less than approximately 0.4 micrometers, and less than a junction depth of the fifth semiconductor region.

20. The semiconductor component of claim 19 wherein:

the fourth semiconductor region has a doping concentration between approximately 5×10 19 and 1×10 20 atoms per cubic centimeter.

21. The semiconductor component of claim 17 wherein:

the fifth semiconductor region has a doping concentration between approximately 1×10 18 and 5×10 19 atoms per cubic centimeter.

22. The semiconductor component of claim 17 wherein:

the third semiconductor region, the fourth semiconductor region, the fifth semiconductor region, and the sixth semiconductor region are asymmetric about a line drawn through a geometric center of the fourth semiconductor region.

23. The semiconductor component of claim 17 wherein:

the zener diode junction is used in the semiconductor component to provide a reference voltage.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2003
From: KHEMKA, VISHNU; PARTHASARATHY, VIJAY; ZHU, RONGHUA; BOSE, AMITAVA; ROGGENBAUER, TODD
To: MOTOROLA, INC.
Reel/Frame 013891/0422 →