Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic components
View Patent ↗The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate the includes or is entirely formed of plastic and it is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.
1. An electronic component, comprising:
a substrate formed with plastic;
a semiconductor chip disposed on said substrate;
a plastic package molding compound embedding said semiconductor chip; and
said plastic of said substrate having a glass transition temperature range below a glass transition temperature range of said plastic package molding compound.
2. The electronic component according to claim 1 , wherein said plastic of said substrate comprises a glass-fiber-reinforced epoxy resin with a polymer additive.
3. The electronic component according to claim 1 , wherein said plastic of said substrate has a glass transition temperature range of between 165° C. and 175° C.
4. The electronic component according to claim 1 , wherein the glass transition temperature range of said plastic package molding compound lies above 175° C. and below a decomposition temperature of said plastic package molding compound.
5. The electronic component according to claim 1 , wherein said plastic package molding compound comprises from 60 to 90% by volume filling material.
6. The electronic component according to claim 5 , wherein said plastic package molding compound comprises from 75 to 85% by volume filling material.
7. The electronic component according to claim 1 , wherein said plastic package molding compound has a coefficient of thermal expansion in each of an X, Y and Z direction of a Cartesian coordinate system of between 10 and 60 ppm/° C.
8. The electronic component according to claim 1 , wherein said substrate has a coefficient of thermal expansion in each of an X and Y direction of a Cartesian coordinate system of from 5 to 15 ppm/° C. and a coefficient of thermal expansion in a Z direction of between 10 and 60 ppm/° C.
9. The electronic component according to claim 1 , wherein a proportion by volume of said substrate in a total volume and a proportion by volume of said plastic package molding compound in the total volume are in a ratio of at least 1 to 3 relative to one another.
10. The electronic component according to claim 1 , wherein said substrate carries a wiring pattern, and said semiconductor chip has an active upper side with flip-chip contacts electrically connected to said wiring pattern on said substrate.
11. The electronic component according to claim 1 , wherein said substrate has a wiring pattern which has contact terminal areas, wiring lines and contact transition areas to contact vias, the contact vias are connected to external contact areas on an opposite side of said substrate and said external contact areas are formed with external contacts.
12. The electronic component according to claim 11 , wherein said external contacts are selected from the group of contacts consisting of solder balls and contact bumps.
13. The electronic component according to claim 11 , wherein said external contacts are arranged in rows and columns in a predetermined grid spacing in a two-dimensional matrix.
14. The electronic component according to claim 1 , wherein said semiconductor chip has an active upper side a bonding channel region and contact areas in said bonding channel region, said contact areas are connected to bonding fingers of a wiring pattern of said substrate by way of bonding connections in a bonding channel opening of said substrate, and said bonding fingers are connected by way of wiring lines of said wiring pattern to external contact areas, and said external contact areas have external contacts formed thereon.
15. The electronic component according to claim 14 , wherein said bonding connections in said bonding channel opening are embedded in said plastic package molding compound.
16. The electronic component according to claim 14 , wherein said external contacts are selected from the group of contacts consisting of solder balls and contact bumps.
17. The electronic component according to claim 14 , wherein said external contacts are arranged in rows and columns in a predetermined grid spacing in a two-dimensional matrix.