Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
View Patent ↗A semiconductor component for electrical coupling to a substrate ( 230 ) includes: a semiconductor chip ( 110 ); a non-leaded leadframe ( 120 ) including a plurality of electrical contacts ( 130 ) located around a periphery ( 111 ) of the semiconductor chip; a first electrical conductor ( 140 ) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound ( 210 ) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface ( 310 ) having a first surface area for electrically coupling to the semiconductor chip; and a second surface ( 320 ) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
1. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:
a semiconductor chip;
a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip;
a first electrical conductor electrically coupling together the semiconductor chip and the non-leaded leadframe; and
a mold compound disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts,
wherein:
at least one electrical contact of the plurality of electrical contacts comprises:
a first surface having a first surface area for electrically coupling to the semiconductor chip;
a second surface opposite the first surface and having a second surface area for electrically coupling to the substrate; and
a side surface coupling together the first surface and the second surface;
the side surface has a first concave section and a second concave section adjacent to the first concave section; and
the second surface area is larger than the first surface area.
2. The semiconductor component of claim 1 wherein:
the at least one electrical contact comprises a trapezoidal cross-sectional shape.
3. The semiconductor component of claim 1 wherein:
the first concave section and the second concave section form at least one mold lock feature.
4. The semiconductor component of claim 1 wherein:
the first concave section is located between the first surface and the second concave section; and
the second concave section is located between the second surface and the first concave section.
5. The semiconductor component of claim 1 wherein:
the first concave section has a first radius of curvature; and
the second concave section has a second radius of curvature less than the first radius of curvature.
6. The semiconductor component of claim 1 wherein:
the at least one electrical contact further comprises:
a side surface coupling the first surface to the second surface and comprising at least one mold lock feature.
7. The semiconductor component of claim 1 wherein:
the first surface comprises at least one mold lock feature.
8. The semiconductor component of claim 7 wherein:
the at least one mold lock feature comprises a recess within the first surface.
9. The semiconductor component of claim 1 wherein:
the second surface has a substantially constant width.
10. The semiconductor component of claim 1 wherein:
the second surface has a first section having a first width and a second section having a second width; and
the second width is less than the first width.
11. The semiconductor component of claim 1 wherein:
the first surface has a first length and a first width;
the second surface has the first length and a second width; and
the second width is greater than the first width.
12. The semiconductor component of claim 1 wherein:
the non-leaded leadframe has a thickness of at least 0.5 centimeters.
13. The semiconductor component of claim 1 wherein:
the second surface of the at least one electrical contact has a first section having a first width and a second section having a second width;
the second width is less than the first width; and
the second surface of another electrical contact of the plurality of electrical contacts has a substantially constant width substantially equal to the first width.
14. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:
a semiconductor chip;
a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip; and
a mold compound disposed around the semiconductor chip and the plurality of electrical contacts;
wherein:
each electrical contact in the plurality of electrical contacts comprises:
a first surface having a first surface area for electrical coupling to the semiconductor chip;
a second surface opposite the first surface and having a second surface area for electrical coupling to the substrate; and
a side surface coupling together the first surface and the second surface;
the second surface area is larger than the first surface area;
each electrical contact of the plurality of electrical contacts comprises a trapezoidal cross-sectional shape;
each side surface comprises at least one mold lock feature; and
the at least one mold lock feature comprises:
a first mold lock feature comprising a first concave section in the side surface; and
a second mold lock feature comprising a second concave section in the side surface and adjacent to the first concave section.
15. The semiconductor component of claim 14 wherein:
the first concave section has a first radius of curvature; and
the second concave section has a second radius of curvature less than the first radius of curvature.
16. The semiconductor component of claim 14 wherein:
the first mold lock feature is located between the first surface and the second mold lock feature; and
the second mold lock feature is located between the second surface and the first mold lock feature.
17. The semiconductor component of claim 14 wherein:
the first surface comprises a first mold lock feature.
18. The semiconductor component of claim 17 wherein:
the first mold lock feature comprises a notch.
19. The semiconductor component of claim 17 wherein:
the first mold lock feature comprises a notch; and
the at least one mold lock feature comprises:
a second mold lock feature comprising a first concave section in the side surface; and
a third mold lock feature comprising a second concave section in the side surface and adjacent to the second mold lock feature.
20. The semiconductor component of claim 19 wherein:
the second mold lock feature is located between the first surface and the third mold lock feature; and
the third mold lock feature is located between the second surface and the second mold lock feature.
21. The semiconductor component of claim 17 wherein:
the second surface has a substantially constant width.
22. The semiconductor component of claim 17 wherein:
the second surface has a first section having a first width, a second section having a second width, and a third section coupling together the first section and the second section; and
the second width is less than the first width.
23. The semiconductor component of claim 22 wherein:
the first surface has a first length and the second width; and
the second surface has the first length.
24. The semiconductor component of claim 22 wherein:
the first surface has a first length and the second width; and
the second surface has a second length greater than the first length.
25. The semiconductor component of claim 24 wherein:
the second surface of a second one of the plurality of electrical contacts has a constant width substantially equal to the first width.
26. The semiconductor component of claim 14 wherein:
the non-leaded leadframe has a thickness of at least 0.5 centimeters.
27. A method of manufacturing a semiconductor component for electrical coupling to a substrate, the method comprising:
providing a non-leaded leadframe comprising:
a plurality of electrical contacts;
wherein:
each one of the plurality of electrical contacts comprises:
a first surface having a first surface area;
a second surface opposite the first surface and having a second surface area; and
a side surface coupling together the first surface and the second surface;
the side surface has a first concave section and a second concave section adjacent to the first concave section; and
the second surface area is larger than the first surface area;
mounting a semiconductor chip adjacent to the non-leaded leadframe;
coupling a first electrical conductor between the first surface of a first one of the plurality of electrical contacts and the semiconductor chip;
disposing a mold compound around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts; and
coupling a second electrical conductor between the second surface of the first one of the plurality of electrical contacts and the substrate.