Method for connecting circuit devices

1. A method of connecting a first and second circuit device, the method comprising:

providing a first circuit device having a first main area;

providing a second circuit device having a second main area and a third main area;

providing a spacer device on one of the first and second circuit devices, thereby ensuring a predetermined spacing between the first and second circuit devices;

applying an adhesive to at least one of the first main area and the second main area;

aligning the first and second circuit devices;

joining the first and second circuit devices;

curing the adhesive,

providing a first electrical contact on the first main area of the first circuit device;

providing a second electrical contact on one of the second main area and the third main area of the second circuit device;

providing a third electrical contact on the spacer device;

aligning the spacer device such that the second and third electrical contacts are in electrical communication with each other.

2. The method of claim 1 , further comprising selecting one of the first and second electrical contacts to be a metallization.

3. The method of claim 1 , further comprising selecting one of the first and second electrical contacts to be a conductive track.

4. The method of claim 1 , further comprising selecting one of the first and second electrical contacts to be a bonding pad.

5. The method of claim 1 , further comprising urging the first and second circuit devices together, thereby causing deformation of the spacer device disposed between the first and second circuit devices.

6. The method of claim 5 , wherein curing the adhesive occurs while the spacer device is deformed.