IP Library Granted Patent US 6,894,342
Granted Patent B1
US 6,894,342 · App. 10/460,278 · Granted May 17, 2005

Structure and method for preventing UV radiation damage in a memory cell and improving contact CD control

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Quick Facts
Patent No.
US 6,894,342
App. No.
10/460,278
Granted
May 17, 2005
Kind
B1
Abstract

According to one exemplary embodiment, a structure comprises a substrate. The structure further comprises at least one memory cell situated on the substrate. The at least one memory cell may be, for example, a SONOS flash memory cell. The structure further comprises an interlayer dielectric layer situated over at least one memory cell and over the substrate. The structure further comprises a first antireflective coating layer situated over the interlayer dielectric layer. According to this exemplary embodiment, the structure further comprises a second antireflective coating layer situated directly over the first anti reflective coating layer. Either the first antireflective coating layer or second antireflective coating layer must be a silicon-rich layer. The first antireflective coating layer and the second antireflective coating may form a UV radiation blocking layer having a UV transparency less than approximately 1.0 percent, for example.

Claims (20)

1. A structure comprising:

a substrate;

at least one memory cell situated on said substrate;

an interlayer dielectric layer situated over said at least one memory cell and over said substrate;

a first antireflective coating layer situated over said interlayer dielectric layer;

a second antireflective coating layer situated directly over said first antireflective coating layer;

an oxide cap layer situated over said second antireflective coating layer;

wherein at least one of said first antireflective coating layer and said second antireflective coating layer is a silicon-rich layer.

2. The structure of claim 1 wherein said first antireflective coating layer has a first refraction index and a first absorption coefficient and said second antireflective coating layer has a second refraction index and a second absorption coefficient, said first refraction index and said first absorption coefficient being respectively different than said second refraction index and said second absorption coefficient.

3. The structure of claim 1 wherein said first antireflective layer and said second antireflective layer form a UV radiation blocking layer, said UV radiation blocking layer having a UV transparency less than approximately 1.0 percent.

4. The structure of claim 1 wherein said first antireflective layer is selected from the group consisting of silicon oxynitride, silicon nitride, silicon-rich oxide, and silicon-rich nitride.

5. The structure of claim 1 wherein said second antireflective layer is selected from the group consisting of silicon oxynitride, silicon nitride, silicon-rich nitride, and silicon-rich oxide.

6. The structure of claim 1 wherein each of said first antireflective coating layer and said second antireflective coating layer has a thickness of between approximately 100.0 Angstroms and approximately 500.0 Angstroms.

7. The structure of claim 1 wherein said at least one memory cell is a SONOS flash memory cell.

8. A structure comprising a substrate, at least one memory cell situated on said substrate, an interlayer dielectric layer situated over said at least one memory cell and over said substrate, a first antireflective coating layer situated over said interlayer dielectric layer, said structure being characterized in that:

a second antireflective coating layer is situated directly over said first antireflective coating layer, wherein at least one of said first antireflective coating layer and said second antireflective coating layer is a silicon-rich layer, wherein an oxide cap layer is situated over said second antireflective coating layer.

9. The structure of claim 8 wherein said first antireflective coating layer comprises a first refraction index and a first absorption coefficient and said second antireflective coating layer comprises a second refraction index and a second absorption coefficient, said first refraction index and said first absorption coefficient being respectively different than said second refraction index and said second absorption coefficient.

10. The structure of claim 8 wherein said first antireflective layer and said second antireflective layer form a UV radiation blocking layer, said UV radiation blocking layer having a UV transparency less than approximately 1.0 percent.

11. The structure of claim 8 wherein said first antireflective layer is selected for the group consisting of silicon oxynitride, silicon nitride, silicon-rich oxide, and silicon-rich oxide.

12. The structure of claim 8 wherein said second antireflective layer is selected from the group consisting of silicon oxynitride, silicon nitride, silicon-rich nitride, and silicon-rich oxide.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 043218/0017 →
RELEASE OF SECURITY INTEREST Recorded Jun 29, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 043062/0183 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036036/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
CHANGE OF NAME Recorded Mar 29, 2006
From: FASL LLC
To: SPANSION LLC
Reel/Frame 017381/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2004
From: AMD (U.S.) HOLDINGS, INC.
To: AMD INVESTMENTS, INC.
Reel/Frame 015494/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2004
From: AMD INVESTMENTS, INC.; FUJITSU LIMITED
To: FASL LLC
Reel/Frame 015494/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2004
From: ADVANCED MICRO DEVICES, INC.
To: AMD (U.S.) HOLDINGS, INC.
Reel/Frame 015494/0842 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2003
From: HUI, ANGELA; VAN NGO, MINH; CHENG, NING; PARK, JAEYONG; YANG, JEAN YEE-MEI; TOKUNO, HIROKAZU; GHANDEHARI, KOUROS; SHIRAIWA, HIDEHIKO
To: ADVANCED MICRO DEVICES, INC.; FUJITSU LTD.
Reel/Frame 014180/0690 →