Method to reduce adhesion between a conformable region and a pattern of a mold
View Patent ↗The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.
1. A method of reducing adhesion forces between a conformable material on a substrate and a mold having an initial pattern, said method comprising:
forming said conformable material on said substrate by depositing, upon said substrate, a conformable composition having a polymerizable compound and non-ionic sufactant molecules, with said non-ionic surfactant molecules being concentrated in a first region of said conformable material with said polymerizable compound being concentrated in a second region of said conformable composition;
contacting said conformable material with said mold; and
solidifying said polymerizable compound, defining solidified material with said first region being positioned between said second region and said mold and a subset of said non-ionic surfactant molecules having an affinity for said mold that is greater than an affinity for said solidified material.
2. The method as recited in claim 1 further including conditioning said mold to be hydrophilic.
3. The method as recited in claim 1 further including conditioning said mold by exposing said mold to a mixture of isopropyl alcohol and said non-ionic surfactant.
4. The method as recited in claim 1 wherein forming said conformable material further includes depositing a plurality of drops of said conformable composition upon said substrate.
5. The method as recited in claim 1 wherein forming said conformable material further includes depositing said conformable composition upon said substrate employing spin-coating techniques.
6. The method as recited in claim 1 further including sequentially contacting said conformable composition a sufficient number of times to accurately reproduce, in said conformable composition, a recorded pattern complementary to said initial pattern.
7. The method as recited in claim 1 wherein forming said conformable material further includes forming said conformable composition from isobornyl acrylate, n-hexyl acrylate, ethylene glycol diacrylate and 2-hydroxy-2-methyl-1-phenyl-propan-1-one and R 1 R 2 .
8. A method of reducing adhesion forces between a substrate and a mold having a patterned region with a surface, said method comprising:
forming a conformable material on said substrate;
contacting said conformable material with said surface; and
forming a conditioned layer from said conformable material having a first and second sub-portions, with said first sub-portion being solidified and said second sub-portion including a plurality of molecules, a subset of which forms hydrogen bonds with said surface generating and defining a first affinity for said surface, with the molecules of said subset having a second affinity for said first sub-portion, such that said first affinity is greater than said second affinity.
9. The method as recited in claim 8 further including conditioning said mold to be hydrophilic before contacting said conformable material.
10. The method as recited in claim 8 further including conditioning said mold by exposing said mold to a mixture of isopropyl alcohol and a surfactant before contacting said conformable material.
11. The method as recited in claim 8 wherein forming said conformable material further includes depositing a plurality of drops of said conformable composition upon said substrate.
12. The method as recited in claim 8 wherein forming said conformable material further includes depositing said conformable composition upon said substrate employing spin-coating techniques.
13. The method as recited in claim 8 further including sequentially contacting said conformable composition a sufficient number of times to accurately reproduce, in said conformable composition, a recorded pattern complementary to said initial pattern.
14. The method as recited in claim 8 wherein forming said conformable material further includes forming said conformable composition from isobornyl acrylate, n-hexyl acrylate, ethylene glycol diacrylate and 2-hydroxy-2-methyl-1-phenyl-propan-1-one and R 1 R 2 .