IP Library Granted Patent US 7,098,682
Granted Patent B2
US 7,098,682 · App. 10/497,514 · Granted Aug 29, 2006

Testing method and tester for semiconductor integrated circuit device comprising high-speed input/output element

Assignee: Japan Science and Technology Agency
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Quick Facts
Patent No.
US 7,098,682
App. No.
10/497,514
Granted
Aug 29, 2006
Kind
B2
Abstract

The invention relates to a test method and a test apparatus for a semiconductor integrated circuit device having a high-speed input/output device, and it has for its object to perform the test of the high-speed I/O exceeding 1 GHz, promptly by a simple board construction, without altering a test system for individual I/O specifications. A semiconductor integrated circuit device ( 1 ) having a high-speed input/output device ( 2 ) is set on a load board ( 3 ) which is provided with loopback paths ( 4 ) each connecting the external output terminal and external input terminal of the semiconductor integrated circuit device ( 1 ) by transmission lines, and the operation of the high-speed input/output device ( 2 ) is tested within the semiconductor integrated circuit device ( 1 ) by utilizing test means ( 5 ) disposed inside the semiconductor integrated circuit device ( 1 ), and the loopback paths ( 4 ).

Claims (7)

1. A method for testing a semiconductor integrated circuit device having a high-speed input/output device, comprising the steps of:

setting the semiconductor integrated circuit device on a load board including a plurality of loopback paths each connecting an external output terminal and an external input terminal of the semiconductor integrated circuit device by transmission lines;

testing an operation of the high-speed input/output device of the semiconductor integrated circuit device by utilizing a test means disposed inside the semiconductor integrated circuit device, and the loopback paths, wherein the test means including:

a test pattern generation means;

a boundary scan register which transfers test patterns generated by the test pattern generation means, to the high-speed input/output device; and

a check means which accepts and checks outputs delivered through the loopback paths, through the external input terminals.

2. The method for testing the semiconductor integrated circuit device having a high-speed input/output device as defined in claim 1 , wherein the test pattern generation means is a pseudo-random pattern generator, and that the check means is an output pattern compressor.

Assignments (4)
MERGER Recorded Sep 8, 2015
From: INTELLECTUAL VENTURES FUND 35 LLC
To: XYLON LLC
Reel/Frame 036563/0846 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2008
From: HIROSHIMA UNIVERSITY
To: INTELLECTUAL VENTURES FUND 35 LLC
Reel/Frame 021691/0922 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2008
From: JAPAN SCIENCE AND TECHNOLOGY AGENCY
To: HIROSHIMA UNIVERSITY
Reel/Frame 020817/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2004
From: SASAKI, MAMORU
To: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Reel/Frame 016077/0748 →
Priority Claims (1)
JP 2001-370609 · Dec 4, 2001 · national
Continuity (1)
Related Publication 20050077905A1 · Apr 14, 2005