Electronic component and panel and method for producing the same
View Patent ↗The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with the aid of a printing operation under normal atmosphere.
1. An electronic component comprising:
a semiconductor chip having edge regions and a back side;
a wiring board; and
a plastic package having first and second plastic package molding compounds arranged one on top of the other, wherein the first plastic package molding compound completely encloses at least the edge regions of the semiconductor chip as a first layer and the second plastic package molding compound is arranged on the back side of the semiconductor chip as a second layer.
2. The electronic component of claim 1 , wherein the first plastic package molding compound of the first layer in an uncrosslinked state has a lower viscosity than the second layer.
3. The electronic component of claim 1 , wherein the viscosities of the first and second layers in an uncrosslinked state differ in such a way that the viscosity of the first layer is lower by at least an order of magnitude than the viscosity of the second layer.
4. The electronic component of claim 1 , wherein the first plastic package molding compound is adapted to application at the edge regions of the semiconductor chip.
5. The electronic component of claim 1 , wherein the second plastic package molding compound is adapted to application over the back side of the semiconductor chip.
6. The electronic component of claim 1 , wherein the first and second layers are produced by means of high-pressure injection-molding processes.
7. The electronic component of claim 1 , wherein the first and second layers are produced by means of vacuum printing processes.
8. A panel with a number of component positions for electronic components comprising:
a leadframe which has in each component position a bonding channel opening that is filled with a plastic covering compound; and
a number of semiconductor chips each with back sides and with intermediate spaces between them, wherein the intermediate spaces are filled with a first layer of plastic package molding compound and the back sides are covered with a second layer of plastic package molding compound.
9. The panel of claim 8 , wherein the plastic package molding compound of the first layer in an uncrosslinked state has a lower viscosity than the second layer.
10. The panel of claim 8 , wherein the viscosities of the first and second layers in an uncrosslinked state differ in such a way that the viscosity of the first layer is lower by at least an order of magnitude than the viscosity of the second layer.
11. The panel of claim 8 , wherein the plastic package molding compound of the first layer is adapted to application in the intermediate spaces.
12. The panel of claim 8 , wherein the plastic package molding compound of the second layer is adapted to application over the back sides.
13. The panel of claim 8 , wherein the first and second layers are produced by means of high-pressure injection-molding processes.
14. The panel of claim 8 , wherein the first and second layers are produced by means of vacuum printing processes.