IP Library Granted Patent US 6,887,138
Granted Patent B2
US 6,887,138 · App. 10/601,248 · Granted May 3, 2005

Chemical mechanical polish (CMP) conditioning-disk holder

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,887,138
App. No.
10/601,248
Granted
May 3, 2005
Kind
B2
Abstract

A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.

Claims (36)

1. A chemical mechanical polishing conditioning disk holder comprising:

a circular gimbal plate having a first surface with a centralized elevated region and an opposite second surface for contact with a conditioning disk;

an overlying gimbal hub attached to the circular gimbal plate and formed to mate in close contact with the centralized elevated region to pivot at the centralized elevated region and substantially avoid physical contact with other portions of the circular gimbal plate;

a flexible disk comprised of a polymer material overlying the gimbal hub, the flexible disk having the polymer material radially continuous substantially completely around a central region of the flexible disk to an outside perimeter of the flexible disk; and

a clamp overlying the flexible disk, the clamp being connected to the circular gimbal plate for connecting the clamp, the gimbal hub and the flexible disk in an assembly.

2. The chemical mechanical polishing conditioning disk holder of claim 1 wherein the polymer material of the flexible disk is polytetrafluoroethylene.

3. The chemical mechanical polishing conditioning disk holder of claim 1 wherein the polymer material of the flexible disk is a flexible plastic material.

4. The chemical mechanical polishing conditioning disk holder of claim 1 wherein the clamp further comprises a clamp ring having threaded holes, each for receiving a screw to connect the clamp to the circular gimbal plate.

5. The chemical mechanical polishing conditioning disk holder of claim 1 wherein the gimbal hub and the flexible disk further comprise connection holes for permitting connection of the gimbal hub and the flexible disk to a drive mechanism via a connection means.

6. The chemical mechanical polishing conditioning disk holder of claim 5 wherein the connection means further comprise a threaded screw in each of connection holes.

7. The chemical mechanical polishing conditioning disk holder of claim 5 wherein the circular gimbal plate further comprises a plurality of holes positioned in close proximity to the centralized elevated region, the plurality of holes permitting access to the connection holes of the gimbal hub.

8. The chemical mechanical polishing conditioning disk holder of claim 1 wherein the circular gimbal plate further comprises a plurality of pins radially positioned on the first surface, the plurality of pins being aligned to alignment holes in the flexible disk and the clamp to assist in assembly alignment and enhancing fixation of the flexible disk.

9. The chemical mechanical polishing conditioning disk holder of claim 8 wherein the plurality of pins further comprise one of either a plurality of dowel pins, a plurality of spring pins, a plurality of threaded screws, and a plurality of tapered pins.

10. The chemical mechanical polishing conditioning disk holder of claim 1 further comprising:

a rotating drive shaft connected to the flexible disk and the gimbal hub, the rotating drive shaft being connected to the flexible disk and the gimbal hub via connection holes in the flexible disk and the gimbal hub.

11. The chemical mechanical polishing conditioning disk holder of claim 10 wherein the rotating drive shaft is connected to the flexible disk and the gimbal hub by at least one of screws, pins, studs or bolts.

12. The chemical mechanical polishing conditioning disk holder of claim 10 wherein the flexible disk is thinner at portions where the flexible disk is being clamped by the circular gimbal plate and the clamp than at other portions of the flexible disk.

13. A chemical mechanical polishing conditioning disk holder comprising:

plate means having a first surface with a centralized elevated region and an opposite second surface for contact with a conditioning disk;

hub means overlying and attached to the plate means at the centralized elevated region in order to pivot at the centralized elevated region and substantially avoid physical contact with other portions of the plate means;

flexible disk means comprised of a polymer material overlying the hub means, the flexible disk means having the polymer material radially continuous substantially completely around a central region of the flexible disk means to an outside perimeter of the flexible disk means; and

clamp means overlying the flexible disk means, the clamp means being connected to the plate means for connecting the clamp means, the hub means and the flexible disk means in an assembly.

14. The chemical mechanical polishing conditioning disk holder means of claim 13 wherein the flexible disk is a disk comprising polytetrafluoroethylene (PTFE).

15. The chemical mechanical polishing conditioning disk holder of claim 13 further comprising:

rotating mechanism means connected to the flexible disk means and the hub means to rotate the assembly.

16. A chemical mechanical polishing holder apparatus, comprising:

a circular planar structure with a rising outer perimeter and an elevated central region;

a gimbal hub tangentially contacting said elevated central region;

a circular elastic element with an outer perimeter and an inner opening having an inner perimeter, wherein said outer perimeter of said circular elastic element fixates said outer perimeter of said circular planar structure to a clamping structure.

17. The chemical mechanical polishing holder apparatus of claim 16 wherein said circular elastic element is polytetrafluoroethylene.

18. The chemical mechanical polishing holder apparatus of claim 16 wherein said inner opening is substantially centralized within said circular elastic element.

19. The chemical mechanical polishing holder apparatus of claim 16 wherein said circular planar structure is a gimbal plate.

20. The chemical mechanical polishing holder apparatus of claim 16 further comprising:

a driving mechanism mounted over said circular elastic element wherein said inner perimeter of said circular elastic element fixates said gimbal hub to said driving mechanism.

21. The chemical mechanical polishing holder apparatus of claim 20 wherein said circular planar structure contains a plurality of holes for accessibility to said driving mechanism.

22. The chemical mechanical polishing holder apparatus of claim 20 wherein said driving mechanism is a shaft.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2003
From: BOTTEMA, BRIAN E.; BUSTOS, LARRY J.; CAIN, MARTIN W.; BROWN, NATHAN R.
To: MOTOROLA, INC.
Reel/Frame 014620/0935 →