IP Library Granted Patent US 7,071,008
Granted Patent B2
US 7,071,008 · App. 10/604,606 · Granted Jul 4, 2006

Multi-resistive state material that uses dopants

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Quick Facts
Patent No.
US 7,071,008
App. No.
10/604,606
Granted
Jul 4, 2006
Kind
B2
Abstract

A multi-resistive state material that uses dopants is provided. A multi-resistive state material can be used in a memory cell to store information. However, a multi-resistive state material may not have electrical properties that are appropriate for a memory device. Intentionally doping a multi-resistive state material to modify the electrical properties can, therefore, be desirable.

Claims (49)

1. A method of modifying electrical properties of a two-terminal memory element in a cross point memory array, comprising:

providing a substrate with active circuitry and multiple layers of conductive paths;

supplying a plurality of two-terminal memory elements between pairs of conductive array lines in a cross point array directly over the substrate, each two-terminal memory element comprising a praseodymium (Pr), calcium (Ca), manganese (Mn), and oxygen (O) perovskite as a multi-resistive state material;

doping the multi-resistive state material to modify at least one electrical property of the multi-resistive state material; and

applying at least one electrical pulse to the pair of conductive array lines, the electrical pulse having a selected polarity, a selected width, a selected maximum value and a selected waveform so as to create an electric field in the multi-resistive state material greater than a threshold electric field value to reversibly change the resistivity of the multi-resistive state material, the pulse having a pulse energy less than a pulse energy required to damage the multi-resistive state material.

2. The method of claim 1 , wherein:

doping the multi-resistive state material modifies resistivity.

3. The method of claim 2 , wherein:

the electrical pulse reversibly changes the resistivity of the multi-resistive state material to a value between 0.1 Ω-cm and 1.0 Ω-cm.

4. The method of claim 1 , wherein:

doping the multi-resistive state material modifies the amount of charge traps.

5. The method of claim 1 , wherein:

doping the multi-resistive state materials improves the data retention capability of the multi-resistive state material.

6. The method of claim 1 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes an ohmic effect.

7. The method of claim 1 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes a Schottky effect.

8. The method of claim 1 , wherein:

the electrical pulse reversibly changes the resistivity of the multi-resistive state material from either a high value to a low value or from a low value to a high value; and

doping the multi-resistive state material modifies the magnitude of the difference from the high value to the low value.

9. The method of claim 8 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes an ohmic effect.

10. The method of claim 8 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes a Schottky effect.

11. The method of claim 1 , wherein:

the electrical pulse reversibly changes the resistivity of the multi-resistive state material to a value between 0.1 Ω-cm and 1.0 Ω-cm.

12. The method of claim 1 , wherein:

doping the multi-resistive state material causes the multi-resistive state material's electrical properties to be more uniform, whereby the electrical properties of the multi-resistive state material have a greater predictability.

13. The method of claim 1 , wherein:

doping the multi-resistive state material additionally reduces the temperature sensitivity of the multi-resistive state material's resistance.

14. The method of claim 4 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes an ohmic effect.

15. The method of claim 4 , wherein:

an interface between the pair of conductive array lines and the multi-resistive state material causes a Schottky effect.

16. The method of claim 1 , wherein:

doping the multi-resistive state material reduces magnetic field dependence.

17. The method of claim 1 , wherein:

the selected waveform is either a square, saw-toothed, triangular, sine wave, or some combination thereof.

18. The method of claim 1 , wherein:

the selected maximum value of the selected waveform is between 1 volt and 15 volts.

19. The method of claim 1 , wherein:

the selected waveform has a duration between 1 nanosecond and 100 microseconds.

20. The method of claim 1 , wherein:

at least two electrical pulses are applied to the multi-resistive state material in order to reversibly change its resistivity.

21. The method of claim 1 , wherein:

the electrical pulse reversibly changes the resistivity of the multi-resistive state material from either a high value to a low value or from a low value to a high value; and

once the multi-resistive state material's resistivity is changed, application of an opposite polarity second electrical pulse will cause the multi-resistive state material's resistivity to revert back to a low value if it was changed to high, or a high value if it was changed to low.

22. The method of claim 1 , further comprising:

doping the multi-resistive state material with a second dopant to modify another electrical property of the multi-resistive state material.

Assignments (3)
RELEASE Recorded Apr 9, 2012
From: SILICON VALLEY BANK; GOLD HILL CAPITAL
To: UNITY SEMICONDUCTOR, INC.
Reel/Frame 028132/0675 →
SECURITY AGREEMENT Recorded Apr 13, 2009
From: UNITY SEMICONDUCTOR CORPORATION
To: GOLD HILL CAPITAL
Reel/Frame 023129/0669 →
MERGER Recorded Jul 28, 2005
From: UNITY SEMICONDUCTOR CORPORATION
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 016323/0107 →