IP Library Granted Patent US 7,485,952
Granted Patent B1
US 7,485,952 · App. 10/607,324 · Granted Feb 3, 2009

Drop resistant bumpers for fully molded memory cards

Assignee: Amkor Technology, Inc.
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Quick Facts
Patent No.
US 7,485,952
App. No.
10/607,324
Granted
Feb 3, 2009
Kind
B1
Abstract

A memory card comprising a leadframe having a plurality of contacts, at least one die pad, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. Also included in the leadframe are at least two bumpers. Attached to the die pad is a semiconductor die which is electrically connected to at least one of the traces. A body defining at least two corner regions at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body, and the bumpers are located at respective ones of the corner regions thereof.

Claims (21)

1. A memory card comprising:

a plurality of contacts;

at least one die pad defining opposed top and bottom surfaces;

a plurality of conductive traces extending from respective ones of the contacts toward the die pad; and

at least two bumpers;

at least one semiconductor die attached to the die pad and electrically connected to at least one of the traces; and

a body defining at least two corner regions and at least partially encapsulating the contacts, the die pad, the bumpers and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body and the bumpers are located at respective ones of the corner regions of the body but do not protrude therefrom.

2. The memory card of claim 1 wherein the traces are bent in a manner such that the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes.

3. The memory card of claim 2 wherein the semiconductor die is attached to the bottom surface of the die pad so as to extend along a die plane which is disposed between and generally parallel to the frame planes.

4. The memory card of claim 2 wherein the semiconductor die is attached to the top surface of the die pad.

5. The memory card of claim 1 wherein:

the body defines an opposed pair of longitudinal sides, an opposed pair of lateral sides, and a sloped side which extends angularly between one of the lateral sides and one of the longitudinal sides;

the contacts extend along one of the lateral sides of the body; and

the at least two bumpers are located at respective ones of a pair of the corner regions which are partially defined by the lateral side of the body opposite that including the contacts extending there along.

6. The memory card of claim 5 wherein each of the bumpers comprises a plurality of bumper segments.

7. The memory card of claim 5 wherein four of the bumpers are located at respective ones of the sloped side and three of the corner regions collectively defined by the longitudinal and lateral sides of the body.

8. The memory card of claim 7 wherein each of the bumpers comprises a plurality of bumper segments.

9. The memory card of claim 1 wherein:

each of the bumpers defines opposed, generally planar top and bottom surfaces;

the body defines opposed, generally planar top and bottom surfaces; and

the top and bottom surfaces of the bumpers are exposed in and substantially flush with respective ones of the top and bottom surfaces of the body.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
SECURITY INTEREST Recorded Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
PATENT SECURITY AGREEMENT Recorded Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2003
From: MIKS, JEFFREY A.; SHIH, JUNGCHUN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 014516/0805 →
Continuity (1)
Continuation In Part 0995619000 · Sep 19, 2001