Polishing system having a carrier head with substrate presence sensing
View Patent ↗A system for polishing a substrate has a controller, pressure source, a platen, and a carrier for handling the substrate. The carrier must be able to detect if a substrate is present. In either the case of a false detection of substrate presence or the failure to detect substrate presence, the likely result is damaged substrates, wasted polishing consumables, and down time of the manufacturing facility. Detection is achieved by the substrate causing movement of a plunger and by such movement resulting in a pressure differential that is detected. The reliability of this detection is improved by one or more of a precise relationship of the plunger to a plate that applies pressure to the substrate, a controlled seal that is ensured of being broken when the plunger is moved by the presence of a substrate, and proper spring pressure applied to the plunger to prevent spurious plunger movement.
1. A system for polishing a substrate, comprising:
a controller;
a platen; and
a carrier head, coupled to the controller, for carrying the substrate and holding the substrate against the platen during polishing;
wherein the carrier head comprises:
a retaining ring for laterally supporting the substrate;
a holding mechanism for applying positive pressure to the substrate during polishing and negative pressure when carrying the substrate, the holding mechanism including a perforated plate and a membrane, the membrane being disposed between the perforated plate and the substrate, wherein responsive to a positive pressure applied to the perforated plate and the membrane, positive pressure is applied to the substrate, and wherein responsive to negative pressure applied to the perforated plate and the membrane, negative pressure is applied to the substrate;
a gimbal plate coupled to the holding mechanism; and
substrate detection means, coupled to the gimbal plate for detecting if the substrate is secured by the holding mechanism when the holding mechanism is applying reactive pressure;
wherein the substrate detection means comprises:
a plunger passing through a hole in the gimbal plate wherein said plunger has a maximum travel distance in the hole, has a bottom surface that extends below the gimbal plate and is coupled to the substrate during detecting, and when the holding mechanism is pressed to the gimbal plate, the plunger extends past the perforated plate of the holding mechanism by an amount substantially equal to the maximum travel distance of the plunger, further wherein the plunger has a reduced thickness in an area above the gimbal plate, wherein the substrate detection means further comprises a compliant sealing ring around the area of the plunger having the reduced thickness.
2. The system of claim 1 , wherein the substrate detection means has a spring applied to a top portion of the plunger above the gimbal plate, wherein the spring has a spring rate greater than 12 pounds per inch and less than 50 pounds per inch.
3. The system of claim 2 , wherein the compliant sealing ring is captured by the plunger in the area of reduced thickness.
4. The system of claim 3 , wherein compliant sealing ring is snugly against the plunger in the area of reduced thickness.
5. The system of claim 4 , wherein the holding mechanism comprises a rigid perforated plate having a uniform thickness of less than 0.12 inch.
6. A system for polishing a substrate, comprising:
a controller;
a platen; and
a carrier head, coupled to the controller, for carrying the substrate and holding the substrate against the platen during polishing;
wherein the carrier head comprises:
a retaining ring for laterally supporting the substrate;
a holding mechanism for applying positive pressure to the substrate during polishing and negative pressure when carrying the substrate, the holding mechanism including a perforated plate and a membrane, the membrane being disposed between the perforated plate and the substrate, wherein responsive to a positive pressure applied to the perforated plate and the membrane, positive pressure is applied to the substrate, and wherein responsive to a negative pressure applied to the perforated plate and the membrane, negative pressure is applied to the substrate;
a gimbal plate coupled to the holding mechanism; and
substrate detection means, coupled to the gimbal plate for detecting if the substrate is secured by the holding mechanism when the holding mechanism is applying negative pressure;
wherein the substrate detection means comprises:
a plunger passing through a hole in the gimbal plate wherein said plunger has a reduced thickness in an area above the gimbal plate, wherein the substrate detection means further comprises a compliant sealing ring around the area of the plunger having the reduced thickness.
7. The system of claim 6 , wherein the compliant sealing ring is captured by the plunger in the area of reduced thickness.
8. The system of claim 7 , wherein compliant sealing ring is snugly against the plunger in the area of reduced thickness.
9. The system of claim 6 , wherein the substrate detection means has a spring applied to a top portion of plunger above the gimbal plate, wherein the spring has a spring rate greater than 12 pounds per inch and less than 50 pounds per inch.
10. A system for polishing a substrate, comprising:
a controller;
a platen; and
a carrier head, coupled to the controller, for carrying the substrate and holding the substrate against the platen during polishing;
wherein the carrier head comprises:
a retaining ring for laterally supporting the substrate;
a holding mechanism for applying positive pressure to the substrate during polishing and negative pressure when carrying the substrate, the holding mechanism including a perforated plate and a membrane, the membrane being disposed between the perforated plate and the substrate, wherein responsive to a positive pressure applied to the perforated plate and the membrane, positive pressure is applied to the substrate, and wherein responsive to a negative pressure applied to the perforated plate and the membrane, negative pressure is applied to the substrate;
a gimbal plate coupled to the holding mechanism; and
substrate detection means, coupled to the gimbal plate for detecting if the substrate is secured by the holding mechanism when the holding mechanism is applying negative pressure;
wherein the substrate detection means comprises:
a plunger passing through a hole in the gimbal plate, wherein the plunger has a reduced thickness in an area above the gimbal plate;
a compliant sealing ring around the area of the plunger having the reduced thickness; and
a spring applied to a top portion of plunger above the gimbal plate, wherein the spring has a spring rate greater than 12 pounds per inch and less than 50 pounds per inch.
11. The system of claim 10 , wherein said plunger has a maximum travel distance in the hole, has a bottom surface that extends below the gimbal plate and is coupled to the substrate during detecting, and when the holding mechanism is pressed to the gimbal plate, the plunger extends past the gimbal plate by an amount substantially equal to the maximum travel distance of the plunger.
12. A system for polishing a substrate, comprising:
a controller;
pressure means, coupled to the controller, for providing pressure as selected by the controller;
a carrier head, coupled to the controller, comprising a holder, a top plate, and a detector for detecting the presence of the substrate in the carrier head;
wherein the detector comprises a plunger passing through a hole in the top plate wherein said plunger has a maximum travel distance in the hole, has a bottom surface that extends below the top plate and is coupled to the substrate during detecting, and when the holder is pressed to the top plate, the plunger extends past the holder by an amount substantially equal to the maximum travel distance of the plunger, further wherein the plunger has a reduced thickness in an area above the top plate, and wherein the detector further comprises a compliant sealing ring around the area of the plunger having the reduced thickness.
13. The system of claim 12 , wherein the compliant sealing ring is captured by the plunger in the area of reduced thickness.
14. The system of claim 13 , wherein compliant sealing ring is snugly against the plunger in the area of reduced thickness.
15. The system of claim 12 , wherein the holder comprises a rigid perforated plate having a uniform thickness of less than 0.12 inch.
16. The system of claim 12 , wherein the detector has a spring applied to a top portion of plunger above the top plate, wherein the spring has a spring rate greater than 12 pounds per inch and less than 50 pounds per inch.
17. A carrier head for use in a polishing system, comprising:
a holder;
a top plate; and
a detector for detecting the presence of the substrate in the carrier head;
wherein the detector comprises a plunger pressing through a hole in the top plate wherein said plunger has a maximum travel distance in the hole, has a bottom surface that extends below the top plate and is coupled to the substrate during detecting, and when the holder is pressed to the top plate, the plunger extends past the holder by an amount substantially equal to the maximum travel distance of the plunger, further wherein the plunger has a reduced thickness in an area above the top plate, and wherein the detector further comprises a compliant sealing ring around the area of the plunger having the reduced thickness.
18. The carrier head of claim 17 , wherein the compliant sealing ring is captured by the plunger in the area of reduced thickness.
19. The carrier head of claim 18 , wherein the compliant sealing ring is snugly against the plunger in the area of reduced thickness.
20. The carrier head of claim 17 , wherein the holder comprises a rigid perforated plate having a uniform thickness of less than 0.12 inch.
21. The carrier head of claim 17 , wherein the detector has a spring applied to a top portion of the plunger above the top plate, wherein the spring has a spring rate greater than 12 pounds per inch and less than 50 pounds per inch.