PECVD silicon-rich oxide layer for reduced UV charging
View Patent ↗A Si-rich silicon oxide layer having reduced UV transmission is deposited by PECVD, on an interlayer dielectric, prior to metallization, thereby reducing V t . Embodiments include depositing a UV opaque Si-rich silicon oxide layer having an R.I. of 1.7 to 2.0.
1. A semiconductor device comprising:
a transistor having a gate structure over a substrate with a gate dielectric layer therebetween;
an interlayer dielectric over the transistor and substrate; and
a silicon-rich silicon oxide layer, which is substantially opaque to UV radiation and has a refractive index (R.I.) greater than 1.6, on an upper surface of the interlayer dielectric, wherein the silicon-rich silicon oxide layer has a thickness of 400 Å to 600 Å.
2. The semiconductor device according to claim 1 , wherein the silicon-rich silicon oxide layer has a R.I. greater than 1.7.
3. The semiconductor device according to claim 2 , wherein the silicon-rich silicon oxide layer has a R.I. of 1.7 to 2.0.
4. The semiconductor device according to claim 1 , wherein the gate structure comprises:
a tunnel oxide as the gate dielectric layer on the substrate;
a floating gate electrode on the tunnel oxide;
an interpoly dielectric comprising an oxide/nitride/oxide (ONO) stack on the floating gate; and
a control gate electrode on the interpoly dielectric.
5. The semiconductor device according to claim 4 , comprising silicon oxide sidewall spacers on side surfaces of the gate structure.
6. The semiconductor device according to claim 5 , comprising a layer of silicon nitride on an upper surface of the gate structure and on the silicon oxide sidewall spacers.
7. The semiconductor device according to claim 1 , wherein the interlayer dielectric comprises a boron-phosphorous-doped silicate glass (BPSG).