IP Library Granted Patent US 6,894,936
Granted Patent B2
US 6,894,936 · App. 10/623,266 · Granted May 17, 2005

Memory device and method for selectable sub-array activation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,894,936
App. No.
10/623,266
Granted
May 17, 2005
Kind
B2
Abstract

A memory device and method for selectable sub-array activation. In one preferred embodiment, a memory array is provided comprising a plurality of groups of sub-arrays and circuitry operative to simultaneously write data into and/or read data from a selected number of groups of sub-arrays. By selecting the number of groups of sub-arrays into which data is written and/or from which data is read, the write and/or read data rate is varied. Such varying can be used to prevent thermal run-away of the memory array. Other preferred embodiments are provided, and each of the preferred embodiments can be used alone or in combination with one another.

Claims (105)

1. A method for writing data in a memory array, the method comprising:

(a) providing a memory device comprising a memory array comprising a plurality of groups of sub-arrays and further comprising a register storing a value N representing a number of groups of sub-arrays into which data will be simultaneously written;

(b) changing the value stored in the register from N to M; and

(c) simultaneously writing data into M groups of sub-arrays.

2. The invention of claim 1 further comprising:

(d) changing the value stored in the register from M to L; and

(e) simultaneously writing data into L groups of sub-arrays.

3. The invention of claim 1 , wherein N comprises a default value.

4. The invention of claim 1 , wherein (b) is performed in response to a signal from a host device coupled with the memory device.

5. The invention of claim 1 , wherein (b) is performed in response to a command issued by a user of a host device coupled with the memory device.

6. The invention of claim 1 , wherein (b) is performed in response to a signal from temperature-based control circuitry.

7. The invention of claim 1 , wherein (b) is performed during testing of the memory array.

8. The invention of claim 1 , wherein the memory array comprises a three-dimensional memory array.

9. The invention of claim 1 , wherein the memory array comprises a plurality of antifuse memory cells.

10. The invention of claim 1 , wherein the memory array comprises a plurality of write-once memory cells.

11. The invention of claim 1 , wherein the memory array comprises a plurality of write-many memory cells.

12. A method for reading data from a memory array, the method comprising:

(a) providing a memory device comprising a memory array comprising a plurality of groups of sub-arrays and further comprising a register storing a value N representing a number of groups of sub-arrays from which data will be simultaneously read;

(b) changing the value stored in the register from N to M; and

(c) simultaneously reading data from M groups of sub-arrays.

13. The invention of claim 12 further comprising:

(d) changing the value stored in the register from M to L; and

(e) simultaneously reading data from L groups of sub-arrays.

14. The invention of claim 12 , wherein N comprises a default value.

15. The invention of claim 12 , wherein (b) is performed in response to a signal from a host device coupled with the memory device.

16. The invention of claim 12 , wherein (b) is performed in response to a command issued by a user of a host device coupled with the memory device.

17. The invention of claim 12 , wherein (b) is performed in response to a signal from temperature-based control circuitry.

18. The invention of claim 12 , wherein (b) is performed during testing of the memory array.

19. The invention of claim 12 , wherein the memory array comprises a three-dimensional memory array.

20. The invention of claim 12 , wherein the memory array comprises a plurality of antifuse memory cells.

21. The invention of claim 12 , wherein the memory array comprises a plurality of write-once memory cells.

22. The invention of claim 12 , wherein the memory array comprises a plurality of write-many memory cells.

23. A method for writing data in a memory array, the method comprising:

(a) providing a memory array comprising a plurality of groups of sub-arrays;

(b) storing a value N representing a number of groups of sub-arrays into which data will be simultaneously written;

(c) changing the stored value from N to M; and

(d) simultaneously writing data into M groups of sub-arrays.

24. The invention of claim 23 , wherein the memory array is part of a memory device comprising a register, and wherein the value is stored in the register.

25. The invention of claim 23 , wherein the value is stored in the memory array.

26. The invention of claim 23 , wherein the memory array is part of a memory device coupled with a host device, and wherein the value is stored in the host device.

27. The invention of claim 23 , wherein the memory array comprises a three-dimensional memory array.

28. The invention of claim 23 , wherein the memory array comprises a plurality of antifuse memory cells.

29. The invention of claim 23 , wherein the memory array comprises a plurality of write-once memory cells.

30. The invention of claim 23 , wherein the memory array comprises a plurality of write-many memory cells.

31. A method for writing data in a passive-element memory array, the method comprising:

(a) providing a passive-element memory array comprising a plurality of groups of sub-arrays;

(b) selecting a number of groups of sub-arrays fewer than all of the groups into which data will be simultaneously written; and

(c) simultaneously writing data into the selected number of groups of sub-arrays.

32. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein (c) comprises simultaneously writing data into fewer than all of the sub-arrays in each of the selected number of groups of sub-arrays.

33. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein (c) comprises simultaneously writing data into all of the sub-arrays in each of the selected number of groups of sub-arrays.

34. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein (c) comprises simultaneously writing data into only one sub-array in each of the selected number of groups of sub-arrays.

35. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein all of the sub-arrays in each respective group share a respective data bus.

36. The invention of claim 35 , wherein (c) comprises simultaneously writing data into fewer than all of the sub-arrays in each of the selected number of groups of sub-arrays.

37. The invention of claim 36 , wherein (c) comprises simultaneously writing data into only one sub-array in each of the selected number of groups of sub-arrays.

38. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein (c) comprises simultaneously writing data into the same number of sub-arrays in each group.

39. The invention of claim 31 , wherein each group of sub-arrays comprises a respective plurality of sub-arrays, and wherein all of the sub-arrays are written into when writing a page of data.

40. The invention of claim 31 , wherein the selected number of groups of sub-arrays is stored in a register.

41. The invention of claim 40 , wherein the register stores a default value, and wherein the default value is overwritten by the selected number of groups of sub-arrays.

42. The invention of claim 31 , wherein the number of groups of sub-arrays is automatically selected by a host device coupled with the memory array.

43. The invention of claim 31 , wherein the number of groups of sub-arrays is manually selected by a user of a host device coupled with the memory array.

44. The invention of claim 31 , wherein the number of groups of sub-arrays is automatically selected by temperature-based control circuitry.

45. The invention of claim 31 , wherein the number of groups of sub-arrays is selected during testing of the memory array.

46. The invention of claim 31 , wherein the memory array comprises a three-dimensional memory array.

47. The invention of claim 31 , wherein the memory array comprises a plurality of antifuse memory cells.

48. The invention of claim 31 , wherein the memory array comprises a plurality of write-once memory cells.

49. The invention of claim 31 , wherein the memory array comprises a plurality of write-many memory cells.

50. A method for writing data in a write-once memory array, the method comprising:

(a) providing a write-once memory array comprising a plurality of groups of sub-arrays;

(b) selecting a number of groups of sub-arrays fewer than all of the groups into which data will be simultaneously written; and

(c) simultaneously writing data into the selected number of groups of sub-arrays.

51. The invention of claim 50 , wherein (b) is performed in user mode and not in test mode.

52. The invention of claim 50 , wherein the selected number of groups of sub-arrays is stored in a register.

53. The invention of claim 52 , wherein the register stores a default value, and wherein the default value is overwritten by the selected number of groups of sub-arrays.

54. The invention of claim 50 , wherein the number of groups of sub-arrays is automatically selected by a host device coupled with the memory array.

55. The invention of claim 50 , wherein the number of groups of sub-arrays is manually selected by a user of a host device coupled with the memory array.

56. The invention of claim 50 , wherein the number of groups of sub-arrays is automatically selected by temperature-based control circuitry.

57. The invention of claim 50 , wherein the number of groups of sub-arrays is selected during testing of the memory array.

58. The invention of claim 50 , wherein the memory array comprises a three-dimensional memory array.

59. The invention of claim 50 , wherein the memory array comprises a plurality of antifuse memory cells.

60. A method for writing data in a memory array used in a host device, the method comprising:

(a) providing a host device coupled with a memory device comprising a memory array comprising a plurality of groups of sub-arrays;

(b) selecting a number of groups of sub-arrays fewer than all of the groups into which data will be simultaneously written; and

(c) simultaneously writing data into the selected number of groups of sub-arrays.

61. The invention of claim 60 , wherein the selected number of groups of sub-arrays is stored in a register in the memory device.

62. The invention of claim 61 , wherein the register stores a default value, and wherein the default value is overwritten by the selected number of groups of sub-arrays.

63. The invention of claim 60 , wherein (b) is performed in user mode and not in test mode.

64. The invention of claim 60 , wherein (b) is performed in the field.

65. The invention of claim 64 , wherein (b) is performed in the field in response to a signal from the host device.

66. The invention of claim 64 , wherein (b) is performed in the field in response to a command issued by a user of the host device.

67. The invention of claim 64 , wherein (b) is performed in the field in response to a signal from temperature-based control circuitry in the memory device.

68. The invention of claim 60 , wherein the memory array comprises a three-dimensional memory array.

69. The invention of claim 60 , wherein the memory array comprises a plurality of antifuse memory cells.

70. The invention of claim 60 , wherein the memory array comprises a plurality of write-once memory cells.

71. The invention of claim 60 , wherein the memory array comprises a plurality of write-many memory cells.

72. A method for writing data in a write-once passive-element memory array, the method comprising:

(a) providing a host device coupled with a memory device comprising a write-once passive-element memory array comprising a plurality of groups of sub-arrays, each group of sub-arrays comprising a respective plurality of sub-arrays sharing a respective data bus;

(b) storing in a register a selected number of groups of sub-arrays fewer than all of the groups into which data will be simultaneously written; and

(c) simultaneously writing data into fewer than all the sub-arrays in each of the selected number of groups of sub-arrays.

73. The invention of claim 72 , wherein (c) comprises simultaneously writing data into only one sub-array in each of the selected number of groups of sub-arrays.

74. The invention of claim 72 , wherein (b) is performed in the field.

75. The invention of claim 74 , wherein (b) is performed in the field in response to a signal from the host device.

76. The invention of claim 74 , wherein (b) is performed in the field in response to a command issued by a user of the host device.

77. The invention of claim 74 , wherein (b) is performed in the field in response to a signal from temperature-based control circuitry in the memory device.

78. The invention of claim 72 , wherein the memory array comprises a three-dimensional memory array.

79. The invention of claim 72 , wherein the memory array comprises a plurality of antifuse memory cells.

Assignments (5)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038813/0004 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE MERGER TO ADD PAGES TO THE MERGER DOCUMENT PREVIOUSLY RECORDED PREVIOUSLY RECORDED ON REEL 017544 FRAME 0769. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 2, 2007
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 018950/0686 →
MERGER Recorded Apr 28, 2006
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 017544/0769 →