IP Library Granted Patent US 7,102,891
Granted Patent B1
US 7,102,891 · App. 10/625,290 · Granted Sep 5, 2006

Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor

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Quick Facts
Patent No.
US 7,102,891
App. No.
10/625,290
Granted
Sep 5, 2006
Kind
B1
Abstract

A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

Claims (17)

1. A multi use circuit module comprising:

a front half module, the front half module being a functional circuit module having electrical contacts on a front portion thereof, the front half module having a channeling formed on the rear section thereof, the channeling running from a side wall of the front half module along a length of the front half module;

a rear half module removably coupled to the front half module, a tab member formed on a front portion of the rear half module;

at least one locking ball formed on a surface within the channeling; and

at least one indentation formed on the tab member, the at least one indentation being similar in size and shape to the at least one locking ball and mating with the at least one locking ball when the tab member is slid within the channeling to lock the front half module to the rear half module.

2. A multi use circuit module in accordance with claim 1 wherein the rear half module is an electrically non-functional component, the rear half module being coupled to the front half module to standardize a size of the multi use circuit module.

3. A multi use circuit module in accordance with claim 1 wherein the at least one locking ball extends downward form a top surface of the channeling.

4. A multi use circuit module in accordance with claim 3 wherein the at least one indentation is formed on a top surface of the tab member.

5. A multi use circuit module in accordance with claim 1 wherein the at least one locking ball is semi-spherical in shape.

6. A multi use circuit module in accordance with claim 1 wherein the front half module is a memory card, the rear half module removably coupled to the front half module to standardize a size of the memory card.

7. A multi use circuit module in accordance with claim 1 further comprising:

a plurality of locking balls formed on a surface within the channeling; and

a plurality of indentations formed on the tab member, the indentations being similar in size and shape to the locking balls and mating with the locking balls when the tab member is slid within the channeling to lock the front half module to the rear half module.

8. A multi use circuit module in accordance with claim 7 wherein the locking balls extend downward form a top surface of the channeling.

9. A multi use circuit module in accordance with claim 8 wherein the indentations are formed on a top surface of the tab member.

10. A multi use circuit module in accordance with claim 7 wherein the locking balls are semi-spherical in shape.

11. A multi use circuit module in accordance with claim 1 wherein the rear half module is an electrically non-functional component.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
SECURITY INTEREST Recorded Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
PATENT SECURITY AGREEMENT Recorded Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2003
From: MIKS, JEFFREY ALAN; MIRANDA, JOHN ARMANDO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 014323/0947 →