IP Library Granted Patent US 6,909,646
Granted Patent B2
US 6,909,646 · App. 10/627,769 · Granted Jun 21, 2005

Semiconductor memory device having improved arrangement for replacing failed bit lines

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Quick Facts
Patent No.
US 6,909,646
App. No.
10/627,769
Granted
Jun 21, 2005
Kind
B2
Abstract

In a bit-line direction, a plurality of memory mats are arranged including a plurality of memory cells respectively coupled to bit lines and word lines, and a sense amplifier array is arranged including a plurality of latch circuits having input/output nodes connected to a half of bit-line pairs separately provided to the memory mats in a region between the memory mats placed in the bit-line direction, thereby making possible to replace with a redundant bit line pair and the corresponding redundant sense amplifier on a basis of each bit-line pair and sense amplifier connected thereto, thereby realizing effective and rational Y-system relief.

Claims (45)

1. A semiconductor memory device, including:

a first bit line;

a second bit line;

a first redundant bit line;

a second redundant bit line;

a plurality of first memory cells connected to said first bit line;

a plurality of second memory cells connected to said second bit line;

a plurality of first redundant memory cells connected to said first redundant bit line;

a plurality of second redundant memory cells connected to said second redundant bit line;

a first amplifier circuit connected to said first bit line and said second bit line to amplify a difference of potential between said first bit line and said second bit line; and

a first redundant amplifier circuit connected to said first redundant bit line and said second redundant bit line to amplify a difference of potential between said first redundant bit line and said second redundant bit line,

wherein said first bit line is to be replaced with said first redundant bit line but said second bit line is not to be replaced with said second redundant bit line.

2. A semiconductor memory device according to claim 1 , wherein said first bit line and said first redundant bit line are included in a first memory array,

said second bit line and said second redundant bit line being included in a second memory array, and

said first amplifier circuit and said first redundant amplifier circuit being formed in a region between said first memory array and said second memory array.

3. A semiconductor memory device according to claim 2 , wherein said second memory array further includes a third bit line,

said semiconductor memory device further including a third memory array including a fourth bit line and a second amplifier circuit connected to said third bit line and said fourth bit line to amplify a potential difference between said third bit line and said fourth bit line; and

said second amplifier circuit being formed in a region between said second memory array and said third memory array.

4. A semiconductor memory device according to claim 1 , wherein said first bit line, said second bit line, said first redundant bit line and said second redundant bit line are included in said first memory array,

said first bit line and said second bit line being arranged in parallel; and

said first redundant bit line and said second redundant bit line being arranged in parallel.

5. A semiconductor memory device according to claim 4 , wherein said first memory array further includes a third bit line and a fourth bit line,

said semiconductor memory device further including a second amplifier circuit connected to said third bit line and said fourth bit line to amplify a potential difference between said third bit line and said fourth bit line;

said first amplifier circuit and said first redundant amplifier circuit being formed in a first region;

said second amplifier circuit being formed in a second region; and

said first memory array being formed in a region between said first region and said second region.

6. A semiconductor memory device according to claim 1 , wherein said first bit line, said second bit line, said first redundant bit line and said second redundant bit line are included in a first memory array.

7. A semiconductor memory device, including:

a plurality of first normal bit lines;

a plurality of second normal bit lines;

a first redundant bit line;

a second redundant bit line;

a plurality of first normal memory cells connected to said plurality of first normal bit lines;

a plurality of second normal memory cells connected to said plurality of second normal bit lines;

a plurality of first redundant memory cells connected to said first redundant bit line;

a plurality of second redundant memory cells connected to said second redundant bit line;

a plurality of first amplifier circuits connected to said plurality of first bit lines and said plurality of second bit lines;

a second amplifier circuit connected to said first redundant bit line and said second redundant bit line to amplify a potential difference between said first redundant bit line and said second redundant bit line; and

an information hold circuit which holds information about replacement of a normal bit line with a redundant bit line,

wherein each of said first amplifier circuits amplifies a potential difference between a corresponding one of said first normal bit lines and a corresponding one of said second normal bit lines,

said information hold circuit replacing one of said first normal bit lines with said first redundant bit line but not replacing one of said second normal bit lines corresponding to said one of said first normal bit lines with said second redundant bit line.

8. A semiconductor memory device according to claim 7 , wherein said information hold circuit can hold information to replace one of said second normal bit lines with said second redundant bit line but not to replace one of said first normal bit lines corresponding to said one of said second normal bit lines with said first redundant bit line.

9. A semiconductor memory device according to claim 7 , wherein said information hold circuit can hold information that one of said first normal bit lines is to be replaced with said second redundant bit line and one of said second normal bit lines with said first redundant bit line.

10. A semiconductor memory device according to claim 7 , wherein said information hold circuit can hold information that one of said first normal bit lines connected to one of said first amplifier circuits and one of said second normal bit lines are to be respectively replaced with said first redundant bit line and said second redundant line.

11. A semiconductor memory device according to claim 7 , wherein said information hold circuit can hold information that one of said first normal bit lines connected to one of said first amplifier circuits is to be replaced with said first redundant bit line and one of said second normal bit lines connected to another of said first amplifier circuits is to be replaced with said second redundant bit line.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046867/0248 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
CHANGE OF NAME Recorded Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032894/0746 →
RELEASE OF SECURITY INTEREST Recorded Feb 24, 2014
From: APPLE, INC
To: ELPIDA MEMORY, INC.
Reel/Frame 032331/0637 →
SECURITY AGREEMENT Recorded Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
SECURITY AGREEMENT Recorded May 15, 2012
From: ELPIDA MEMORY, INC.
To: APPLE INC.
Reel/Frame 028209/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2006
From: HITACHI, LTD.
To: ELPIDA MEMORY, INC.
Reel/Frame 018420/0080 →