IP Library Granted Patent US 6,841,810
Granted Patent B1
US 6,841,810 · App. 10/637,405 · Granted Jan 11, 2005

Cell structure for bipolar integrated circuits and method

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Quick Facts
Patent No.
US 6,841,810
App. No.
10/637,405
Granted
Jan 11, 2005
Kind
B1
Abstract

In one embodiment, a bipolar cell ( 31 ) includes a cell boundary ( 32 ) that defines a cell active area ( 33 ), a first array of bipolar transistors ( 41 ) is formed within the cell active area ( 33 ) and configured for a first function. The bipolar transistors ( 42 ) within the first array ( 41 ) are parallel to each other. The bipolar cell ( 31 ) further includes a second array of bipolar transistors ( 61 ) formed within the cell active area ( 33 ) and configured for a second function that is different than the first function. The bipolar transistors ( 62 ) within the second array ( 61 ) are parallel to each other and oriented in a different direction than the transistors ( 42 ) in the first array ( 41 ).

Claims (31)

1. A bipolar cell comprising:

a cell active area;

a first array of bipolar transistors within the cell active area and configured for a first function, wherein the bipolar transistors within the first array are parallel to each other;

a second array of bipolar transistors within the cell active area and configured for a second function different than the first function, wherein the bipolar transistors within the second array are parallel to each other and oriented in a different direction than the bipolar transistors in the first array.

2. The bipolar cell of claim 1 wherein the first array comprises a 2×M array, where M is less than or equal to 4.

3. The bipolar cell of claim 1 wherein the second array comprises a 1×N array, where N is greater than or equal to 2.

4. The bipolar cell of claim 1 wherein the bipolar transistors in the second array are substantially perpendicular to the bipolar transistors in the first array.

5. The bipolar cell of claim 1 further comprising an array of resistors.

6. The bipolar cell of claim 1 wherein the first array of bipolar transistors comprises switching transistors.

7. The bipolar cell of claim 1 wherein the second array of bipolar transistors comprises current source transistors.

8. The bipolar cell of claim 1 wherein each bipolar transistor in the first array of bipolar transistors comprises a collector/space/emitter/base configuration.

9. The bipolar cell of claim 1 wherein each bipolar transistor in the second array of bipolar transistors comprises a collector/base/emitter configuration.

10. A bipolar cell comprising

a cell active area;

a first array of bipolar transistors within the cell active area, wherein the bipolar transistors within the first array are parallel to each other;

a second array of bipolar transistors within the cell active area, wherein the bipolar transistors within the second array are parallel to each other and substantially perpendicular to the first array of bipolar transistors, and wherein at least one bipolar transistor in the second array comprises a base/emitter/collector/emitter/base configuration.

11. The bipolar cell of claim 10 , wherein the bipolar transistors in the first array comprise a collector/base/emitter configuration.

12. An integrated circuit comprising:

a bipolar device array including a device active area, wherein the bipolar device array is formed on a semiconductor substrate;

a first array of at least two bipolar transistors formed within the device active area, wherein the bipolar transistors in the first array are parallel to each other;

a second array of at least two bipolar transistors formed within the device active area, wherein the bipolar transistors in the second array are parallel to each other and substantially orthogonal to the bipolar transistors in the first array.

13. The integrated circuit of claim 12 wherein the first array comprises an array of switching transistors.

14. The integrated circuit of claim 13 wherein the array of switching transistors comprises transistors having a collector/space/emitter/base configuration.

15. The integrated circuit of claim 13 wherein at least one device in the array of switching transistors comprises a common collector configuration.

16. The integrated circuit of claim 12 wherein the second array comprises an array of current source transistors.

17. The integrated circuit of claim 16 wherein the array of current source transistors comprises transistors having a collector/emitter/base configuration.

18. A method for forming an integrated circuit comprising the steps of:

providing a semiconductor substrate having a first major surface; and

forming a bipolar device array on the first major surface, wherein the bipolar device array includes a device active area, a first array of at least two bipolar transistors within the device active area, and a second array of at least two bipolar transistors within the device active area, wherein the bipolar transistors in the first array are parallel to each other, and wherein the bipolar transistors in the second array are parallel to each other and substantially perpendicular to the bipolar transistors in the first array.

19. The method of claim 18 wherein the step of forming the bipolar device array includes forming a bipolar device array wherein the first array comprises an array of switching transistors, and wherein the second array comprises an array of current source transistors.

20. The method of claim 18 wherein the step of forming the bipolar device array includes forming a bipolar device array wherein at least one device in one of the first and second arrays comprises a base/emitter/collector/emitter/ base configuration.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →