Method of forming a semiconductor package and structure thereof
View Patent ↗An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer ( 42, 64 ) over a mold encapsulant ( 35, 62 ). The conductive layer ( 42, 64 ) may be electrically coupled using a wire to the leadframe ( 10, 52 ) of the semiconductor package ( 2, 50 ). The electrical coupling can be performed by wire bonding two device portions ( 2, 4, 6, 8 ) of a leadframe ( 10 ) together and then cutting the wire bond ( 32 ) by forming a groove ( 40 ) in the overlying mold encapsulant ( 35 ) to form two wires ( 33 ). The conductive layer ( 42 ) is then electrically coupled to each of the two wires ( 33 ). In another embodiment, a looped wire bond ( 61 ) is formed on top of a semiconductor die ( 57 ). After mold encapsulation, portions of the mold encapsulant ( 62 ) are removed to expose portions of the looped wire bond ( 61 ). The conductive layer ( 64 ) is then formed over the mold encapsulant ( 62 ) and the exposed portion of the looped wire bond ( 61 ) so that the conductive layer ( 64 ) is electrically coupled to the looped wire bond ( 61 ).
1. A semiconductor package comprising:
a leadframe having a flag and a bond pad;
a semiconductor die attached to the flag and electrically coupled to the bond pad;
a mold encapsulant over the semiconductor die;
a conductive layer over the mold encapsulant, wherein the conductive layer comprises a ferromagnetic material; and
a wire electrically coupling the leadframe to the conductive layer.
2. The semiconductor package of claim 1 , wherein the conductive layer comprises NiFe.
3. The semiconductor package of claim 1 , wherein the conductive layer comprises an element selected from the group consisting of aluminum, copper, tin and zinc.
4. The semiconductor package of claim 1 , wherein the conductive layer comprises a ferromagnetic material and a nonferromagnetic metal.
5. The semiconductor package of claim 1 , wherein the wire is coupled to the semiconductor die.
6. The semiconductor package of claim 1 , wherein the wire is coupled to the leadframe through a pad.
7. The semiconductor package of claim 1 , wherein the conductive layer is an electromagnetic shield.
8. A method of forming a semiconductor package, the method comprising:
providing a leadframe having a flag;
attaching a semiconductor die to the flag;
forming a mold encapsulant over the semiconductor die;
forming a conductive layer over the mold encapsulant, wherein forming a conductive layer further comprises electrically coupling the conductive layer to the wire; and
electrically coupling the leadframe to the conductive layer using a wire, wherein electrically coupling the leadframe to the conductive layer using a wire further comprises:
providing a wire having a first end and a second end:
electrically coupling the first end and the second end of the wire to the semiconductor die: and
removing a portion of the mold encapsulant to expose a portion of the wire.
9. The method of claim 8 , wherein:
forming a mold encapsulant over the semiconductor die, further comprises forming the mold encapsulant over the wire.
10. The method of claim 9 , wherein removing the mold encapsulant to expose the wire further comprises forming a groove in the mold encapsulant, wherein the groove has sidewalls.
11. The method of claim 10 , wherein forming the conductive layer further comprises forming the conductive layer over the sidewalls of the groove.