Method for controlling semiconductor chips and control apparatus

1. A method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus, wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising the following method steps:

a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of on which modules the semiconductor chips reside, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width;

b) activating the semiconductor chips in the selected group; and

c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips;

wherein the semiconductor chips are selected using a statistical method.

2. The method as claimed in claim 1 ,

wherein the statistical method takes into account at least one of an arrangement of the semiconductor chips on the modules and an arrangement of the modules in relation to one another or in relation to one or more other adjacent components.

3. The method as claimed in claim 1 ,

wherein the statistical method takes into account at least one of empirically obtained and currently ascertained data.

4. The method as claimed in claim 1 , wherein method steps a) to c) take place at the beginning of a startup procedure in which the semiconductor chips are started.

5. The method as claimed in claim 1 , wherein the semiconductor chips are memory chips, and wherein the method steps a) to c) take place at a time at which content of the memory chips is redundant.

6. The method as claimed in claim 1 , wherein the semiconductor chips are memory chips, and wherein data already stored in the memory chips are stored in a buffer store before a group of memory chips is selected in method step a).

7. A method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus, wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising the following method steps:

a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of on which modules the semiconductor chips reside, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width;

b) activating the semiconductor chips in the selected group; and

c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips;

wherein each of the semiconductor chips has an associated selection probability.

8. The method as claimed in claim 7 ,

wherein the semiconductor chips are arranged in three dimensions with respect to one another; and

wherein the associated selection probability for a semiconductor chip depends on its relative situation with respect to adjacent semiconductor chips, and wherein a semiconductor chip in an outer region of the modules has a higher selection probability than a semiconductor chip in an inner region.

9. A method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common date bus, wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising the following method steps:

a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of on which modules the semiconductor chips reside, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width;

b) activating the semiconductor chips in the selected group; and

c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips;

wherein the prescribed selection criterion is a temperature of the semiconductor chips and wherein semiconductor chips having the lowest temperature are selected.

10. The method as claimed in claim 9 ,

wherein method steps a) to c) are repeated and different semiconductor chips are selected in method step a) in a course of two cycles taking place at successive times.

11. A method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus, wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising the following method steps:

a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of on which modules the semiconductor chips reside, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width;

b) activating the semiconductor chips in the selected group; and

c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips;

wherein each of the semiconductor chips arranged on the modules has an associated individual index which denotes a corresponding module and a position of a corresponding semiconductor chip on the corresponding module;

wherein associated indices for the group of semiconductor chips which was selected independently of the modules in method step a) are stored in a register device; and

wherein the associated indices for the semiconductor chips associated with a corresponding group are read from the register device in method step b) and corresponding semiconductor chips are activated using their associated indices.

12. A method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus, wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising the following method steps:

a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of on which modules the semiconductor chips reside, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width;

b) activating the semiconductor chips in the selected group; and

c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips;

wherein, besides the group of semiconductor chips which is selected in method step a), a further group of further semiconductor chips is selected independently of module, and the semiconductor chips in this further group likewise use the data lines in the common data bus over the entire bus width, and

wherein the data interchange between the data lines in the data bus and the semiconductor chips in the group selected in method step c) involves alternating between groups of semiconductor chips.

13. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside; and

an activation device for activating the semiconductor chips in the selected group for data interchange with data lines in the common data bus;

wherein the selection device is configured to assign each semiconductor chip an individual selection probability based on its relative situation in a three-dimensional arrangement of the semiconductor chips.

14. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside;

an activation device for activating the semiconductor chips in the selected group for data interchange with data lines in the common data bus; and

an assessment device for assessing the semiconductor chips according to prescribed criteria, particularly a temperature of the semiconductor chips, and

wherein the selection device is configured to select the semiconductor chips based on assessment results from the assessment device.

15. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside; and

an activation device for activating the semiconductor chips in the selected group for data interchange with data lines in the common data bus;

wherein the activation device is configured to activate the semiconductor chips in an active group using an index which is individually associated with each of the semiconductor chip and denotes a corresponding module and a position of a corresponding semiconductor chip within the corresponding module.

16. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside;

an activation device for activating the semiconductor chips in the selected group for data interchange with data lines in the common data bus; and

a register device for storing the information about an association between the semiconductor chips and an active group of semiconductor chips.

17. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside; and

an activation device for activating the semiconductor chips in a selected group for data interchange with data lines in the common data bus;

wherein the selection device is configured to select the semiconductor chips for an active group based on a temperature of the semiconductor chips.

18. A control apparatus for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus;

wherein each semiconductor chip on each module is connected to at least one data line in the common data bus, comprising:

a selection device for selecting the semiconductor chips for a group cyclically based on a prescribed selection criterion independently of on which modules the semiconductor chips reside; and

an activation device for activating the semiconductor chips in a selected group for data interchange with data lines in the common data bus;

wherein the selection device is configured to select the semiconductor chips for an active group using a statistical method.