IP Library Granted Patent US 6,949,961
Granted Patent B2
US 6,949,961 · App. 10/678,769 · Granted Sep 27, 2005

Power switch structure with low RDSon and low current limit

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Quick Facts
Patent No.
US 6,949,961
App. No.
10/678,769
Granted
Sep 27, 2005
Kind
B2
Abstract

In one embodiment, a power switch device ( 33 ) includes a first MOSFET device 41 and a second MOSFET device ( 42 ). A split gate structure ( 84 ) including a first gate electrode ( 48,87 ) controls the first MOSFET device ( 41 ). A second gate electrode ( 49,92 ) controls the second MOSFET device ( 42 ). A current limit device ( 38 ) is coupled to the first gate electrode ( 48,97 ) to turn on the first MOSFET device during a current limit mode. A comparator device ( 36 ) is coupled to the second gate electrode ( 49,92 ) to turn on the second MOSFET device ( 42 ) when the power switch device ( 33 ) is no longer in current limit mode.

Claims (19)

1. A hot swap protection device comprising:

a split gate switching device including a first MOSFET device having a first gate electrode and a second MOSFET device having a second gate electrode;

a current limit device coupled to the first gate electrode for controlling the first MOSFET device during a current limit mode of operation; and

a comparator device coupled to the first and second gate electrodes for turning on the second MOSFET device during non-current limit mode of operation.

2. The device of claim 1 wherein the split gate switching comprises:

a plurality of first gate electrodes for controlling a plurality of first MOSFET devices; and

a plurality of second gate electrodes for controlling a plurality of second MOSFET devices, wherein at least one second gate electrode is interdigitated between a pair of first gate electrodes.

3. The device of claim 1 further comprising a load device coupled to drain regions of the first and second MOSFET devices.

4. The device of claim 3 wherein the load device comprises a DC/DC converter.

5. The device of claim 1 wherein the first and second MOSFET devices are formed in one body of semiconductor material.

6. The device of claim 1 wherein the first and second MOSFET devices, the current limit device, and the comparator device are formed on one body of semiconductor material.

7. The device of claim 1 wherein the first MOSFET device forms an inrush current limit device.

8. A power switching structure comprising:

a split gate switching device including a first switch having a first control electrode and a second switch having a second control electrode;

a current limit device coupled to the first control electrode for controlling the first switch during a current limit mode of operation; and

a comparator device coupled to the second control electrode for turning on the second switch during a non-current limit mode of operation.

9. The structure of claim 8 further comprising a load device coupled to the first and second switches.

10. The structure of claim 8 wherein the first and second switches are formed in one body of semiconductor material.

11. The structure of claim 8 wherein the first and second switches, the current limit device, and the comparator device are formed on one body of semiconductor material.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
RELEASE OF SECURITY INTEREST Recorded May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2005
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016183/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2003
From: ROBB, STEPHEN P.; BRIGGS, DAVID K.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.
Reel/Frame 014579/0571 →