IP Library Granted Patent US 6,963,506
Granted Patent B1
US 6,963,506 · App. 10/679,179 · Granted Nov 8, 2005

Circuit and technique for accurately sensing low voltage flash memory devices

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Quick Facts
Patent No.
US 6,963,506
App. No.
10/679,179
Granted
Nov 8, 2005
Kind
B1
Abstract

An exemplary sensing circuit for sensing the current drawn by a target memory cell comprises a first transistor connected across a first node and a second node, a load connected across the second node and a third node, and a voltage boosting circuit coupled to a supply voltage, wherein the voltage boosting circuit supplies a voltage at the third node which is greater than the supply voltage.

Claims (27)

1. A sensing circuit for a target memory cell, said sensing circuit comprising:

said target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation;

a first transistor being connected across said first node and a second node;

a load being connected across said second node and a third node; and

a voltage boosting circuit being coupled to a supply voltage, said voltage boosting circuit supplying a voltage at said third node which is greater than said supply voltage.

2. The sensing circuit of claim 1 wherein a sense amp input voltage is generated at said second node during said read operation.

3. The sensing circuit of claim 1 wherein said target memory cell is capable of storing four charge levels.

4. The sensing circuit of claim 3 wherein said four charge levels comprises a first charge level drawing approximately 0 microamperes during said read operation, a second charge level drawing approximately 10 microamperes during said read operation, a third charge level drawing approximately 15 microamperes during said read operation, and a fourth charge level drawing approximately 20 microamperes during said read operation.

5. The sensing circuit of claim 1 wherein said voltage boosting circuit comprises a charge pump driven by a two-phase clock.

6. The sensing circuit of claim 1 wherein a source of said target memory cell is coupled to a reference voltage, and a gate of said target memory cell is connected to a word line, said word line activating said target memory cell during said read operation.

7. The sensing circuit of claim 6 , wherein said reference voltage is ground.

8. A multi-level charge memory device comprising:

a target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation; and

a sensing circuit comprising a first transistor, a load, and a voltage boosting circuit, said first transistor being connected across said first node and a second node, said load being connected across said second node and a third node, said voltage boosting circuit being coupled to a supply voltage, said voltage boosting circuit supplying a voltage at said third node which is greater than said supply voltage.

9. The multi-level charge memory device of claim 8 wherein a sense amp input voltage is generated at said second node during said read operation.

10. The multi-level charge memory device of claim 8 wherein said target memory cell is capable of storing four charge levels.

11. The multi-level charge memory device of claim 10 wherein said four charge levels comprises a first charge level drawing approximately 0 microamperes during said read operation, a second charge level drawing approximately 10 microamperes during said read operation, a third charge level drawing approximately 15 microamperes during said read operation, and a fourth charge level drawing approximately 20 microamperes during said read operation.

12. The multi-level charge memory device of claim 8 wherein said voltage boosting circuit comprises a charge pump driven by a two-phase clock.

13. The multi-level charge memory device of claim 8 wherein a source of said target memory cell is coupled to a reference voltage, and a gate of said target memory cell is connected to a word line, said word line activating said target memory cell during said read operation.

14. The multi-level charge memory device of claim 13 , wherein said reference voltage is ground.

15. A sensing circuit for a target memory cell, said target memory cell having a drain capable of being connected to a first node through a selection circuit during a read operation involving said target memory cell, said target memory cell drawing a target memory cell current when activated during said read operation, a first transistor being connected across said first node and a second node, said sensing circuit being characterized by:

a load being connected across said second node and a third node, a voltage boosting circuit being coupled to a supply voltage, said voltage boosting circuit supplying a voltage at said third node which is greater than said supply voltage.

16. The sensing circuit of claim 15 wherein a sense amp input voltage is generated at said second node during said read operation.

17. The sensing circuit of claim 15 wherein said target memory cell is capable of storing four charge levels.

18. The sensing circuit of claim 17 wherein said four charge levels comprises a first charge level drawing 0 approximately microamperes during said read operation, a second charge level drawing approximately 10 microamperes during said read operation, a third charge level drawing approximately 15 microamperes during said read operation, and a fourth charge level drawing approximately 20 microamperes during said read operation.

19. The sensing circuit of claim 15 wherein said voltage boosting circuit comprises a charge pump driven by a two-phase clock.

20. The sensing circuit of claim 15 wherein a source of said target memory cell is coupled to a reference voltage, and a gate of said target memory cell is connected to a word line, said word line activating said target memory cell during said read operation.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
RELEASE OF SECURITY INTEREST Recorded Jun 12, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042769/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2017
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 042108/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036037/0716 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →