Chemical-mechanical planarization composition with nitrogen containing polymer and method for use
View Patent ↗A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polyamidopolyethyleneimine). The composition possesses both high stability towards gelling and/or solids formation and high selectivity for metal removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).
1. A polishing composition comprising:
a) an organometallic-modified abrasive; and
b) a nitrogen-containing polymer compound;
wherein the organometallic-modified abrasive is derived by surface modification of an unmodified abrasive with an organometallic compound, the unmodified abrasive possesses a negative zeta potential, and the organometallic-modified abrasive possesses a positive zeta potential in the polishing composition.
2. The polishing composition of claim 1 wherein the nitrogen-containing polymer compound is a polyalkyleneimine.
3. The polishing composition of claim 1 wherein the abrasive is a colloidal abrasive.
4. The polishing composition of claim 1 further comprising an oxidizing agent.
5. The polishing composition of claim 1 further comprising a corrosion inhibitor that includes a tolyltriazole derivative.
6. The polishing composition of claim 1 further comprising a corrosion inhibitor that includes an amino acid derivative.
7. The polishing composition of claim 1 further comprising a corrosion inhibitor and that includes an amino acid derivative and a tolyltriazole derivative.
8. The polishing composition of claim 1 wherein the organometallic-modified abrasive and the nitrogen-containing polymer compound are characterized to possess the same charge.
9. The polishing composition of claim 1 wherein the abrasive is silica.
10. The polishing composition of claim 1 wherein metal modification is effected with at least one organometallic compound.
11. The polishing composition of claim 10 wherein the at least one organometallic compound comprises aluminum.
12. The polishing composition of claim 2 wherein the polyalkyleneimine is a branched polymer.
13. The polishing composition of claim 2 wherein the polyalkyleneimine is a polyethyleneimine.
14. The polishing composition of claim 13 wherein the polyethyleneimine is substituted and has the structure:
H 2 N—(—CH 2 —CH 2 NT—) m —(—CH 2 CH 2 —NH—) n
where T is —(CH 2 ) p NHCOR′, p=1–10, and R′ is a C 1 –C 8 alkyl group and where mand n are integers having a value greater than or equal to 1.
15. The polishing composition of claim 1 further comprising a pH of less than 7.
16. The polishing composition of claim 1 further comprising a level of the nitrogen-containing polymer compound in the composition ranges from 0.005 weight % to 1 weight %.